3D Chip Stack Technology Using Through-Chip Interconnects.

Autor: Benkart, Peter, Kaiser, Alexander, Munding, Andreas, Bschorr, Markus, Pfleiderer, Hans-Joerg, Kohn, Erhard, Heittmann, Arne, Huebner, Holger, Ramacher, Ulrich

Publikováno v: IEEE Design & Test of Computers; Nov/Dec2005, Vol. 22 Issue 6, p512-518, 7p, 5 Black and White Photographs, 4 Diagrams, 2 Graphs