Zobrazeno 1 - 8
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pro vyhledávání: '"Bryan Reese"'
Publikováno v:
SPIE Proceedings.
Most leading-edge IC fabs continue to use direct reticle inspection for "early warning" detection of haze defects before they print on wafers. This inspection strategy enables fabs to cost-effectively maintain the highest product yields possible. As
Autor:
Trent Hutchinson, Marcus Liesching, Bryan Reese, Gong Chen, Derek Summers, Hai Ying, Russell Dover
Publikováno v:
SPIE Proceedings.
To minimize potential wafer yield loss due to mask defects, most wafer fabs implement some form of reticle inspection system to monitor photomask quality in high-volume wafer manufacturing environments. Traditionally, experienced operators review ret
Publikováno v:
SPIE Proceedings.
Tritone reticle designs present many challenges for both photomask manufacturers and defect inspection equipment suppliers. From a fabrication standpoint, multi-write and process steps for tritone layers add levels of complexity and increased cost no
Autor:
Kaustuve Bhattacharyya, Michael Lang, Stephen Cox, Bryan Reese, Stephanie Maelzer, Farzin Mirzaagha, Andre Poock
Publikováno v:
SPIE Proceedings.
High resolution mask inspection in advanced wafer fabs is a necessity. Initial and progressive mask defect problem still remains an industry wide mask reliability issue. Defect incidences and its criticality vary significantly among the type of masks
Publikováno v:
SPIE Proceedings.
Recent interest and inclusion to the ITRS roadmap for the investigation of NIL (Nano Imprint Lithography) has brought back to life 1X mask making. Not only does NIL require 1X pattering, it also requires physical contact with the patterning media, wh
Autor:
Douglas Van Den Broeke, Bryan Reese, Stephen Hsu, Larry S. Zurbrick, Bryan S. Kasprowicz, Anthony Vacca, Darren Taylor
Publikováno v:
SPIE Proceedings.
CPL Technology is a promising resolution enhancement technique (RET) to increase the lithography process window at small feature line widths 1-4 . Successful introduction of a reticle based RET needs to address several reticle manufacturing areas.
Publikováno v:
SPIE Proceedings.
As AAPSM becomes more widely utilized, the need for defect inspection sensitivity becomes more critical. In addition, accurate defect characterization must be performed to encompass new effects caused by glass defects. Historically, defect size and p
Autor:
Aibua Dong, Bryan Reese
Publikováno v:
SPIE Proceedings.
Current manufacturing techniques for advanced wafers require reticle patterns to contain a variety of OPC structures. These structures include several types and sizes of serifs and assist bars creating many technical challenges for reticle inspection