Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Bruno Tolla"'
Publikováno v:
IMAPSource Proceedings. 2022
Integration of smaller, higher-functioning devices and use of advanced high thermal chip structures present thermal management challenges in the aerospace sector where reliability is the top priority and fail-safe processes/materials are the standard
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb756c2f0203fd505c335444e0c163e2
https://doi.org/10.4071/001c.74591
https://doi.org/10.4071/001c.74591
Publikováno v:
International Symposium on Microelectronics. 2019:000360-000363
Over the past decade, electronic parts have become smaller, more complex, and highly functional. This is well understood for many products within the consumer and handheld markets. Miniaturization, however, is also impacting sectors such as aerospace
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e0d595b6bf9b1dcf3a4c336b9937279d
https://doi.org/10.4071/2380-4505-2019.1.000360
https://doi.org/10.4071/2380-4505-2019.1.000360
Publikováno v:
International Symposium on Microelectronics. 2015:000856-000861
One step chip attach materials (OSCA) are dispensable polymeric materials for flip chip assembly, which are designed to flux metallic interconnections and subsequently turn into an underfill upon curing. OSCA materials enable a drastic simplification
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::189086d5840190e2ffc5df5ae338f1a2
https://doi.org/10.4071/isom-2015-thp44
https://doi.org/10.4071/isom-2015-thp44
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:001502-001529
One step chip attach materials (OSCA) are dispensable polymeric materials for flip chip assembly, which are designed to flux metallic interconnections and subsequently turn into an underfill upon curing. OSCA materials enable a drastic simplification
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::536cb4d9c268cfbb794e8fb3b10c3786
https://doi.org/10.4071/2015dpc-wp23
https://doi.org/10.4071/2015dpc-wp23
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
One step chip attach (OSCA) materials are dispensable polymeric materials for flip chip assembly, which are designed to flux metallic interconnections and subsequently cure into an underfill providing mechanical reinforcement and environmental resist
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8018875538dd11c26f8f35c8070316db
https://doi.org/10.1109/ectc.2015.7159589
https://doi.org/10.1109/ectc.2015.7159589
Autor:
Louis Rabardel, Alain Demourgues, Thierry Seguelong, Bruno Tolla, Michel Ménétrier, Michel Pouchard, Olivier Isnard
Publikováno v:
Journal of Materials Chemistry. 9:3131-3136
The amazing oxygen exchange properties within the Ce2Sn2O7–Ce2Sn2O8 pyrochlore solid solution were investigated by means of in situ neutron diffraction experiments. The structural modification of the Ce2Sn2O7 phase heated under oxygen up to 1000 °
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e29f703028f089fdb1e0d5df3a8b549f
https://doi.org/10.1039/a905914h
https://doi.org/10.1039/a905914h
Autor:
Bruno Tolla, David Boldridge
Publikováno v:
MRS Proceedings. 1157
We have examined the Large Particle Count (LPC) analytical method to see whether there are opportunities to improve both the accuracy and precision in hope of improving the utility of the LPC measurement. We have identified weaknesses in the current
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::695d201156424b7eef2bda55a28466e3
https://doi.org/10.1557/proc-1157-e04-07
https://doi.org/10.1557/proc-1157-e04-07