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pro vyhledávání: '"Bruno Knuts"'
Autor:
Reed Gleason, Marc Van Dievel, Peter Hanaway, Bruno Knuts, Erik Jan Marinissen, T. Daenen, Kenneth R. Smith, Eric W. Strid, Mike Jolley, Luc H. Dupas
Publikováno v:
ITC
Practical silicon stacking requires pre-tested dies, but contact probing of TSV interconnects requires much higher density, lower probing forces, and lower cost per pin than conventional probe cards have achieved. This paper examines a cost-effective
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::429d3d41cdbfd848cee1b32e42cf5cd8
https://doi.org/10.1109/test.2011.6139180
https://doi.org/10.1109/test.2011.6139180
