Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Bruno Imbert"'
Publikováno v:
IMF Working Papers. 2022:1
Publikováno v:
ECS Transactions. 75:273-281
In this paper we study the formation and behaviour of liquid Al-Ge alloy, its solidification, the resulting microstructures and the appearance of voids in bonded structure for MEMS packaging. The underneath layer influences the wettability of liquid
Publikováno v:
Journées Nationales sur les Composites 2017
Journées Nationales sur les Composites 2017, École des Ponts ParisTech (ENPC), Jun 2017, 77455 Champs-sur-Marne, France
Journées Nationales sur les Composites 2017, Jun 2017, 77455 Champs-sur-Marne, France
HAL
Journées Nationales sur les Composites 2017, École des Ponts ParisTech (ENPC), Jun 2017, 77455 Champs-sur-Marne, France
Journées Nationales sur les Composites 2017, Jun 2017, 77455 Champs-sur-Marne, France
HAL
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::29e6446488ef29a11bd4c7e7547d15a9
https://hal.archives-ouvertes.fr/hal-01623245/document
https://hal.archives-ouvertes.fr/hal-01623245/document
Autor:
Cyril Guedj, Nicolas Chevalier, Bruno Imbert, Jean-Marc Fabbri, Floriane Baudin, L. Di Cioccio, D. Mariolle, V. Delaye, Yves Bréchet
Publikováno v:
ECS Transactions. 50:125-132
Direct metal bonding represents an advanced joining technology that allows vertical stacking with electrical conduction and even heat dissipation. For most metals used as bonding layers, direct bonding when operating at ambient air involves metal oxi
Autor:
Mariolle Denis, Stephane Thieffry, Nicolas Chevalier, Ionut Radu, Bruno Imbert, Frederic Mazen, Thomas Signamarcheix, Floriane Baudin, Lea Di Cioccio, Angelique Mounier, Vincent Delaye, Gweltaz Gaudin, Thomas Lacave
Publikováno v:
ECS Transactions. 50:169-175
While significant research effort on various planar approaches, the 3D vertical IC stacking is undoubtedly gaining increasing momentum as a leading contender in the challenge to meet performance, cost, and size demands through this decade and beyond.
Publikováno v:
Journal of Rheology. 57:333-348
Being able to model at what point a yield stress material starts to flow under its own weight is of great importance for many practical applications. However, describing the deformation of yield stress fluids under gravity is anything but a simple ex
Autor:
William Vandendaele, Jean-Christophe Crebier, Julie Widiez, Bruno Imbert, Bastien Letowski, Marc Rabarot, Nicolas Rouger
Publikováno v:
Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on
Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
HAL
Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
HAL
International audience; This paper presents a wafer-level fabrication process of 3D power module based on 8-inch wafer devices and 8-inch metallic bulk leadframe. This approach relies on the intermixing of the packaging process with the front-end fab
Autor:
Bastien Letowski, Julie Widiez, Nicolas Rouger, Marc Rabarot, William Vandendaele, Bruno Imbert, Jean-Christophe Crebier
Publikováno v:
HAL
Symposium de Genie Electrique
Symposium de Genie Electrique, Jun 2016, Grenoble, France
Symposium de Genie Electrique
Symposium de Genie Electrique, Jun 2016, Grenoble, France
International audience; Nous présentons dans ce papier l'état d'avancement d'une approche d'assemblage collectif en 3D de modules électroniques de puissance, basée sur des étapes technologiques de fabrication à l'échelle de la plaque (200 mm d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::18f077aa883672fecbb8c187e1ffbbaa
https://hal.archives-ouvertes.fr/hal-01361603
https://hal.archives-ouvertes.fr/hal-01361603
Autor:
V. Klinger, E. Oliva, Thierry Salvetat, Jean-Sébastien Moulet, Paul-Henri Haumesser, Christophe Lecouvey, Frank Dimroth, Romain Thibon, Thierry Mourier, Aurélie Tauzin, Thomas Signamarcheix, Paul Beutel, Guillaume Rodriguez, Jean-Marc Fabbri, Bruno Imbert, Frank Fournel, Abdelhak Hassaine, Christophe Jany
Publikováno v:
AIP Conference Proceedings.
The Solar cell front side is a key design point for improved cell efficiency as a trade is made between optical losses (shadowing effect) and electrical losses (resistance). One solution consists in frontside contacts report to the cell’s backside
Autor:
Hubert Moriceau, Thomas Signamarcheix, Tarik Chaira, Charlotte Drazek, Bruno Imbert, Aurélie Tauzin, Frank Fournel, Paul Beutel, Shay Reboh, Julien Duvernay, Emmanuelle Lagoutte, Cedric Charles-Alfred, Christophe Lecouvey, Y. Bogumilowicz, T.N.D. Tibbits, Eric Guiot, V. Carron, Frank Dimroth, Jude Guelfucci, Bruno Ghyselen, Thierry Salvetat, F.P. Luce
Publikováno v:
AIP Conference Proceedings.
A photovoltaics conversion efficiency of 46% at 508 suns concentration was recently demonstrated with a four-junction solar cell consisting in a GaAs-based top tandem cell transferred onto an InP-based bottom tandem cell, by means of wafer bonding. W