Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Bruce Xu"'
Publikováno v:
ASCEND 2022.
Autor:
Jay Li, Wei Jhen Chen, Joe Lin, Mu Hsuan Chan, Tank Lo, Bruce Xu, Liang Yih Hung, Nicholas Kao, Don Son Jiang, Yu-Po Wang
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
Biophysical Journal. 122:545a
Autor:
Nakul Narang, Siok Wei Lim, Bruce Xu, Kee Hian Tan, Toan Pham, Wenfeng Zhang, Junho Cho, Geoff Zhang, Chi Fung Poon, Hongtao Zhang, Parag Upadhyaya, Winson Lin, Jin Namkoong, Yohan Frans, Ken Chang, Arianne Roldan
Publikováno v:
IEEE Journal of Solid-State Circuits. 54:18-28
The design of a dual-mode, 19–58-Gb/s four-level pulse-amplitude modulation (PAM-4) and 9.5–29-Gb/s nonreturn to zero (NRZ), transceiver in 16-nm FinFET is presented. The fully adaptive receiver consists of a multi-stage continuous time linear eq
Autor:
Jay Im, Ken Chang, Yohan Frans, Neto Pedro W, Ronan Casey, Kay Hearne, Declan Carey, Bruce Xu, Marc Erett, Vikas Sooden, Winson Lin, Wenfeng Zhang, Kevin Geary, Thomas Mallard, James Hudner, Parag Upadhyaya, Mark Smyth
Publikováno v:
IEEE Journal of Solid-State Circuits. 52:1783-1797
This paper presents a flexible-reach 0.5–16.3 Gb/s serial transceiver which is integrated into a field-programmable gate array (FPGA) and fabricated in 16-nm FinFET CMOS. The transceiver is fully adaptive to cover the FPGA requirement to support a
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, the new LTD PKG. (liquid thermal dissipation package) technology is presented to provide the best solution for high and large-area thermal dissipation, and is applied in FCBGA (flip chip ball grid array).For LTD PKG., the enclosed spac
Autor:
Bruce Xu, Ronan Casey, Haibing Zhao, Mayank Raj, James Hudner, Ken Chang, Kee Hian Tan, Hongtao Zhang, Ted Lee, Neto Pedro W, Winson Lin, Declan Carey, Nakul Narang, Marc Erett, Ping-Chuan Chiang, Hongyuan Zhao, Arianne Roldan, Kevin Geary, Yohan Frans
Publikováno v:
CICC
A multi-lane short-reach wireline transceiver is implemented in 16nm FinFET. Taking advantage of a low-loss channel with minimum reflections, 56Gbps NRZ differential signaling is employed, using only a continuous time linear equalizer (CTLE) in the r
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
This paper studies the reliability of high power module package in torque mounting assembly process and temperature cycling reliability by simulation. The power module package, which with initial warpage, will be mounted on an outer heat sink with to
Autor:
Nakul Narang, Kee Hian Tan, Geoff Zhang, Siok Wei Lim, Chi Fung Poon, Toan Pham, Yohan Frans, Junho Cho, Jin Namkoong, Bruce Xu, Arianne Roldan, Ken Chang, Wenfeng Zhang, Hongtao Zhang, Winson Lin, Parag Upadhyaya
Publikováno v:
ISSCC
Trends in IoT and cloud computing continue to accelerate bandwidth demand, requiring technology innovation to cover 50G, 100G and 400G ports without significant increase in cost or power per bit. In order to mitigate the cost of infrastructure upgrad
Publikováno v:
Asia Pacific Journal of Public Health. 27:NP2489-NP2497
This study aims to examine resources and utilization of traditional Chinese medicine (TCM) and factors influencing TCM utilization in urban community health centers (CHCs) in Hubei Province of China. A cross-sectional survey including 234 government-