Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Bruce C. Chou"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:544-551
A via-first process for metallizing copper on glass substrates is presented using a thin, patternable polymer film, electroless copper deposition, and semiadditive processing. A procedure for partially precuring the polymer was developed in order to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e682c7b9274a8b7bfb6c18be0d2180f4
https://doi.org/10.1109/tcpmt.2017.2654219
https://doi.org/10.1109/tcpmt.2017.2654219
Autor:
Brett Sawyer, Fuhan Liu, Bruce C. Chou, Rao Tummala, Venky Sundaram, Ryuta Furuya, William Vis
Publikováno v:
International Symposium on Microelectronics. 2016:000007-000012
This paper presents the design and demonstration of a glass package that emulates a 400 Gbps optical transceiver module. The co-design methodology ensures that requirements for optical, electrical, and thermal interconnects are met. It terms of optic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78f3ec50be11aef63310b712ab9f68c2
https://doi.org/10.4071/isom-2016-tp12
https://doi.org/10.4071/isom-2016-tp12
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 13:51-57
This article presents the modeling, design, fabrication, and characterization of ultra-low loss 3-D optical waveguides integrated on a glass photonic substrate. A novel, single-step process was developed using moving-mask lithography to fabricate a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a469789ae0d0d019c9c827f5f341649b
https://doi.org/10.4071/imaps.502
https://doi.org/10.4071/imaps.502
Autor:
Ting-Chia Huang, Rao Tummala, Bruce C. Chou, Vanessa Smet, Yoichiro Sato, Tailong Shi, Venky Sundaram, Hiroyuki Matsuura, Satomi Kawamoto, Kadappan Panayappan, Tomonori Ogawa
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper presents the design, fabrication, assembly, and characterization of a fully-integrated single-chip glass BGA package at 40/80 µm off-chip I/O pitch with multilayered wiring and through-package-vias (TPVs) at 160 µm pitch. The designed te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a6b252cd5c9779204733de719651b7b
https://doi.org/10.1109/ectc.2016.372
https://doi.org/10.1109/ectc.2016.372
Autor:
Brett Sawyer, Venky Sundaram, Kadappan Panayappan, Rao Tummala, Jialing Tong, Hugues Tournier, Shuhui Deng, Bruce C. Chou, William Vis
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper presents the design and demonstration of redistribution layers directly on the surface of glass for high-speed 28 Gbps signaling applications. An unprecedented demand for bandwidth to support cloud and edge computing driven by online servi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::727931edff88c0ac3116a75519a83a5d
https://doi.org/10.1109/ectc.2016.321
https://doi.org/10.1109/ectc.2016.321
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper presents the first demonstration of a novel fiber coupling structure that enables low-loss and low-cost fiber coupling in an ultra-miniaturized 3D glass photonic interposer. The novel 3D coupling structure consists of a tapered optical wav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::783110083bbb41de4fbf03886c35a1d5
https://doi.org/10.1109/ectc.2016.332
https://doi.org/10.1109/ectc.2016.332
Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors
Autor:
Venky Sundaram, Srikrishna Sitaraman, Bruce C. Chou, Parthasarathi Chakraborti, Min Suk Kim, Himani Sharma, Saumya Gandhi, P. Markondeya Raj, Rao Tummala
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper demonstrates 3D functional modules that are ultra-miniaturized, high-performance and low-cost, based on an innovative 3D Integrated Passive and Active Component (3D IPAC) concept [1]. The 3D IPAC concept utilizes an ultra-thin (30–100 mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1df180a7c8c6000df29cb49c29fd36a0
https://doi.org/10.1109/ectc.2015.7159597
https://doi.org/10.1109/ectc.2015.7159597
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Metallizing ultra-thin glass interposer with through-vias with high adhesion and at low cost is one of the primary challenges in producing next-generation glass-based system packages. This paper describes and investigates a new approach towards creat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c32da927d0a798adb5d74b4ddf7d1205
https://doi.org/10.1109/ectc.2015.7159749
https://doi.org/10.1109/ectc.2015.7159749
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper describes the modeling, design, and demonstration of high-speed differential transmission lines on a 130µm thin glass interposer with two re-distribution layers (RDL), line lengths of 1–50mm, and turn radii of 0.15–8mm for 16-channel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::378ff2a094fcd6d649da72fd62d9ac60
https://doi.org/10.1109/ectc.2015.7159906
https://doi.org/10.1109/ectc.2015.7159906
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper presents the modeling, design and demonstration of a three-dimensional polymer waveguide (3D WG) that couples two optical through-package vias (TPVs) in a 3D ultra-thin glass interposer for chip-to-chip optical communications. Coupling of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dbbfdc9336a7aadbcf6c4e2f575dedfc
https://doi.org/10.1109/ectc.2015.7159684
https://doi.org/10.1109/ectc.2015.7159684