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pro vyhledávání: '"Bruce C. B. Chan"'
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Since their inception over 30 years ago, underfills have enabled numerous new packages and have provided the required support and reliability needed for highly miniaturized and lead-free devices. It is safe to say that without these essential materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca007a5ba94394e90f470a36d3b1acde
https://doi.org/10.1109/ectc.2009.5074014
https://doi.org/10.1109/ectc.2009.5074014
