Zobrazeno 1 - 10
of 233
pro vyhledávání: '"Bruce Archambeault"'
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 12:42-43
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d956e83983cd45fcf296734bf1fc1f35
https://doi.org/10.1109/memc.2023.10136442
https://doi.org/10.1109/memc.2023.10136442
Autor:
Wiren D. Becker, James L. Drewniak, Bruce Archambeault, Siqi Bai, Albert E. Ruehli, Samuel Connor, Matteo Cocchini, Jonghyun Cho, Biyao Zhao
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 62:1266-1277
A physics-based circuit modeling methodology for system-level power integrity (PI) analysis and design is presented herein. The modeling methodology is based on representing the current paths in the power distribution network (PDN) with appropriate c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8185d3a4576187bb47630bf181c8d9be
https://doi.org/10.1109/temc.2019.2927742
https://doi.org/10.1109/temc.2019.2927742
Autor:
Samuel Connor, Albert E. Ruehli, Bruce Archambeault, Stephen Scearce, Matteo Cocchini, Siqi Bai, Jun Fan, Brice Achkir, Biyao Zhao, James L. Drewniak
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 9:80-90
An approach is presented for power integrity analysis on multi-layer printed circuit boards in this paper. Two critical current paths are analyzed. Inductance decomposition is applied to identify the critical parameters that can influence the PDN inp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2875d028a45483b585ea4050bab5e398
https://doi.org/10.1109/memc.2020.9327998
https://doi.org/10.1109/memc.2020.9327998
Autor:
Matteo Cocchini, Jun Fan, Shuang Liang, Biyao Zhao, James L. Drewniak, Albert E. Ruehli, Bruce Archambeault, Brice Achkir, Samuel Connor
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 9:84-94
A modeling methodology to calculate the decoupling capacitor interconnect inductance in a multi-layer PCB is proposed herein. The methodology is based on the resonant cavity model of parallel planes. The self-inductance and mutual inductance are extr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d403459c6cf354afd307fc22a918c613
https://doi.org/10.1109/memc.2020.9241560
https://doi.org/10.1109/memc.2020.9241560
Autor:
Stefano Piersanti, Antonio Orlandi, Francesco de Paulis, Sam Connor, Mohammad Ali Khorrami, Paul Dixon, Bruce Archambeault, James L. Drewniak
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 60:196-201
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b94360dcc15b388175f83ad96af8b366
https://doi.org/10.1109/temc.2017.2731794
https://doi.org/10.1109/temc.2017.2731794
Autor:
Bruce Archambeault, James L. Drewniak, Stefano Piersanti, Sam Connor, Antonio Orlandi, Mohammad Ali Khorrami, Paul Francis Dixon, Francesco de Paulis
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 60:188-195
Electromagnetic emission from electronic devices is one of the aspect to be considered from electromagnetic Engineers and Designers; its prediction can be essential to avoid the degradation of the performance of the system. Using absorbing material i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31ec26f44d1fb64bd829a6a3e37b59fe
https://doi.org/10.1109/temc.2017.2726548
https://doi.org/10.1109/temc.2017.2726548
Autor:
James L. Drewniak, Ketan Shringarpure, Jun Fan, Jingook Kim, Brice Achkir, Bruce Archambeault, Siming Pan
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 59:1993-2001
Power distribution network (PDN) design in high speed digital systems is a critical challenge for system performance. Common design methodologies refer to guidelines and engineering best practices while using simulations to evaluate the design. If th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5789046749b1725f35ae46a74f5d44c
https://doi.org/10.1109/temc.2017.2673851
https://doi.org/10.1109/temc.2017.2673851
Autor:
James L. Drewniak, Mohammad Khorrami, Francesco de Paulis, Bruce Archambeault, Paul Francis Dixon, Stefano Piersanti, Antonio Orlandi, Sam Connor
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 59:1196-1202
The problem of a correct modeling of the electromagnetic field distribution in the near field region is one of the most challenging and interesting due to its direct implication in the engineering evaluation of the shielding effectiveness of material
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f296f5be7e7fa51b64df177176a82d16
https://doi.org/10.1109/temc.2017.2674179
https://doi.org/10.1109/temc.2017.2674179
Autor:
Sam Connor, Stefano Piersanti, Antonio Orlandi, James L. Drewniak, Bruce Archambeault, Paul Francis Dixon, Mohammad Ali Khorrami, Francesco de Paulis
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 59:1203-1210
This paper analyzes, in a quantitative way, the properties of the spatial distribution at the interface of the wave impedance as defined by Schelkunoff, in order to understand if and under which assumptions his transmission line theory for the evalua
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::377ec34ec555290f560f2eadfd4dd0ee
https://doi.org/10.1109/temc.2017.2674183
https://doi.org/10.1109/temc.2017.2674183
Autor:
Siqi Bai, Tamar Makharashvili, Samuel Connor, James L. Drewniak, Ying S. Cao, Jun Fan, Albert E. Ruehli, Bruce Archambeault, Jonghyun Cho, Li Jun Jiang
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 59:1339-1346
Proper power integrity (PI) analysis is required for printed circuit board (PCB) power distribution network (PDN) design. Top-layer interconnect inductance for PI has always been a vital concern for high-speed industry. Developing a simple physics-ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5544bd2d33d29628b10702d0d2abd3cb
https://doi.org/10.1109/temc.2017.2672726
https://doi.org/10.1109/temc.2017.2672726