Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Britta Schafsteller"'
Publikováno v:
IMAPSource Proceedings. 2022
The surface finish on a printed circuit board (PCB) or substrate serves as surface protection and at the same time enables a variety of assembly techniques. Depending on which final finish is selected it allows for e.g. soldering connections or wire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef090d0328847623f64ef41a0005ca0a
https://doi.org/10.4071/001c.74481
https://doi.org/10.4071/001c.74481
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cba2525c1e81f6dcd1a61143471e64a5
https://doi.org/10.1109/ectc51906.2022.00080
https://doi.org/10.1109/ectc51906.2022.00080
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Electroless nickel/electroless palladium/immersion gold (ENEPIG) is an accepted and well established finish for high performance and high reliability applications in a growing market. With the nickel it provides a reliable diffusion barrier and at th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a3d4d64905f72839edf1cef4ada8446
https://doi.org/10.1109/impact50485.2020.9268601
https://doi.org/10.1109/impact50485.2020.9268601
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The autocatalytic deposition of tin is gaining increasing interest as it offers several benefits compared to the immersion type deposition. Despite the fact that in contrast to the immersion plating process there is no technical limitation of the thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a6b78387c69c92b0e3f2a6e16f6722f
https://doi.org/10.1109/ectc32862.2020.00308
https://doi.org/10.1109/ectc32862.2020.00308
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
The presented study focus on the mechanistic understanding of the autocatalytic tin deposition. The results are encouraging enough to further evaluate the autocatalytic tin electrolytes as a valuable alternative in specific applications in the IC sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f17f04be4143010ed089358198fb576a
https://doi.org/10.1109/icsj47124.2019.8998646
https://doi.org/10.1109/icsj47124.2019.8998646
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolved in the recent years due to ever increasing demands in terms of reliability, component miniaturization and sig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f86570e6b7d2349dbaadcbff725662ac
https://doi.org/10.1109/impact47228.2019.9024967
https://doi.org/10.1109/impact47228.2019.9024967