Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Brice McPherson"'
Publikováno v:
IEEE Transactions on Power Electronics. 37:12415-12425
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::554486dbbe82b170645ebf5d6b15c4f5
https://doi.org/10.1109/tpel.2022.3176981
https://doi.org/10.1109/tpel.2022.3176981
Publikováno v:
International Symposium on Microelectronics. 2018:000317-000325
The performance of SiC power devices has demonstrated superior characteristics as compared to conventional Silicon (Si) devices. Some of the advantages of SiC power devices over Si include higher voltage blocking capability, low specific on-resistanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e1d473e9ab72ff204c911b0fc35c453
https://doi.org/10.4071/2380-4505-2018.1.000317
https://doi.org/10.4071/2380-4505-2018.1.000317
Autor:
Brice McPherson, Tim Foster, Sayan Seal, Marcelo Schupbach, Lauren E. Kegley, Brandon Passmore, Robert Shaw, Ty McNutt
Publikováno v:
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP).
Power cycling is an accelerated reliability test used to induce package-related failure mechanisms through exposure to cyclic thermal and electrical stress. As SiC devices continue to grow in adoption for high power density, high efficiency applicati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5de1c773bf3e35067d4f31a41c227d6
https://doi.org/10.1109/iwipp.2019.8799100
https://doi.org/10.1109/iwipp.2019.8799100
Publikováno v:
International Symposium on Microelectronics. 2015:000353-000358
Silicon carbide (SiC) wide bandgap semiconductor power device technologies offer improved electrical and thermal performance over silicon in high performance power electronic applications, such as hybrid or fully electric vehicles, aerospace, solar i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f64eaf4a3955efbfec5a5d2147ac73e3
https://doi.org/10.4071/isom-2015-wp16
https://doi.org/10.4071/isom-2015-wp16
Publikováno v:
Extreme Environment Electronics ISBN: 9781315216911
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1db003876d0576dd0cffae0b556848e0
https://doi.org/10.1201/b13001-69
https://doi.org/10.1201/b13001-69
Publikováno v:
Extreme Environment Electronics ISBN: 9781315216911
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71bcdd3df32e25a94d1bee1d664d6ea4
https://doi.org/10.1201/b13001-80
https://doi.org/10.1201/b13001-80
Publikováno v:
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP).
Silicon Carbide (SiC) wide band gap power devices are capable of operating at extremely high current densities and switching frequencies. Systems embracing these benefits can achieve a substantial increase in power density. However, cooling becomes e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::516c86687afd915dc7f7091e1d9011f2
https://doi.org/10.1109/iwipp.2017.7936760
https://doi.org/10.1109/iwipp.2017.7936760
Autor:
Brice McPherson
Publikováno v:
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf5482e20cfdf91bedd9f99c255b2769
https://doi.org/10.1109/3dpeim.2016.7570561
https://doi.org/10.1109/3dpeim.2016.7570561
Autor:
Yuki Nakano, Ty McNutt, Robert Shaw, Brice McPherson, Alex Lostetter, Bradley A. Reese, Takashi Nakamura, Jared Hornberger, Roberto Schupbach, Takukazu Otsuka
Publikováno v:
SAE International Journal of Passenger Cars - Electronic and Electrical Systems. 6:10-17
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a7ba8bf90be42c9626c53ab0557d724
https://doi.org/10.4271/2012-01-2209
https://doi.org/10.4271/2012-01-2209
Autor:
Kraig Olejniczak, Alex Lostetter, Robert Shaw, Brandon Passmore, Zach Cole, Brice McPherson, Adam Barkley, Bradley A. Reese, Daniel Martin, Ty McNutt, Bret Whitaker
Publikováno v:
2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).
APEI, Inc. manufactures high performance, high temperature wide bandgap discrete packages, multi-chip power modules (MCPMs), and integrated systems for extreme environment applications. In this paper, APEI, Inc. presents two MCPMs, the HT-2000 and X-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e8d23b72324da58fa140916aeed3274
https://doi.org/10.1109/pedg.2013.6785623
https://doi.org/10.1109/pedg.2013.6785623