Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Brice Grandchamp"'
Autor:
Isaac Haik Dunn, Elyes Nefzaoui, Jerome Loraine, Imene Lahbib, Georges Hamaoui, Tuyen Duc Nguyen, Brice Grandchamp, Philippe Basset, Gregory U'Ren
Publikováno v:
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Autor:
Insaf Lahbib, Gregory U'Ren, Hassan Saleh, Brice Grandchamp, Ousmane Sow, Jerome Loraine, Frederic Drillet, Albert Kumar, Imene Lahbib, Lucas Iogna-Prat
Publikováno v:
International Journal of Microwave and Wireless Technologies. 13:517-522
This paper presents the radio frequency (RF) measurements of an SPST switch realized in gallium nitride (GaN)/RF-SOI technology compared to its GaN/silicon (Si) equivalent. The samples are built with an innovative 3D heterogeneous integration techniq
Autor:
Tuyen-Duc Nguyen, Isaac Haik Dunn, Elyes Nefzaoui, Georges Hamaoui, Philippe Basset, Jerome Loraine, Imene Lahbib, Brice Grandchamp, Gregory U'Ren
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Autor:
Tauno Vähä-Heikkilä, Robert Malmqvist, P. Rantakari, C. Samuelsson, Brice Grandchamp, A. Gustafsson, S. Reyaz
Publikováno v:
International Journal of RF and Microwave Computer-Aided Engineering. 25:639-646
This work presents a monolithic integrated reconfigurable active circuit consisting of a W-band RF micro-electro-mechanical-systems MEMS Dicke switch network and a wideband low-noise amplifier LNA realized in a 70 nm gallium arsenide GaAs metamorphic
Autor:
Seonho Seok, Winfried Simon, Janggil Kim, Brice Grandchamp, Nathalie Rolland, M. Fryziel, Rens Baggen
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3, pp.1799-1803. ⟨10.1109/TCPMT.2013.2278713⟩
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2013, 3, pp.1799-1803. ⟨10.1109/TCPMT.2013.2278713⟩
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3, pp.1799-1803. ⟨10.1109/TCPMT.2013.2278713⟩
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2013, 3, pp.1799-1803. ⟨10.1109/TCPMT.2013.2278713⟩
This paper presents benzocyclobutene (BCB) cap packaging of Microelectromechanical systems (MEMS) switches integrated with a thin monolithic microwave integrated circuit (MMIC) wafer. To prevent a possible breakage during BCB bonding process, the 100
Autor:
Robert Malmqvist, C. Samuelsson, M. Fryziel, P. Rantakari, Paul-Alain Rolland, Seonho Seok, Vähä‐Heikkilä, Brice Grandchamp, Tauno, S. Reyaz
Publikováno v:
Microwave and Optical Technology Letters
Microwave and Optical Technology Letters, 2013, 55, pp.2849-2853. ⟨10.1002/mop.27983⟩
Reyaz, S B, Samuelsson, C, Malmqvist, R, Seok, S, Fryziel, M, Rolland, P-A, Grandchamp, B, Rantakari, P & Vähä-Heikkilä, T 2013, ' W-band RF-MEMS dicke switch networks in a GaAs MMIC process ', Microwave and Optical Technology Letters, vol. 55, no. 12, pp. 2849-2853 . https://doi.org/10.1002/mop.27983
Microwave and Optical Technology Letters, Wiley, 2013, 55, pp.2849-2853. ⟨10.1002/mop.27983⟩
Microwave and Optical Technology Letters, 2013, 55, pp.2849-2853. ⟨10.1002/mop.27983⟩
Reyaz, S B, Samuelsson, C, Malmqvist, R, Seok, S, Fryziel, M, Rolland, P-A, Grandchamp, B, Rantakari, P & Vähä-Heikkilä, T 2013, ' W-band RF-MEMS dicke switch networks in a GaAs MMIC process ', Microwave and Optical Technology Letters, vol. 55, no. 12, pp. 2849-2853 . https://doi.org/10.1002/mop.27983
Microwave and Optical Technology Letters, Wiley, 2013, 55, pp.2849-2853. ⟨10.1002/mop.27983⟩
This thesis presents solutions and studies related to the design of reconfigurable and wideband receiver circuits for system-on-chip (SoC) radiometer front-ends within the millimetre-wave (mm-wave) range. Whereas many of today’s mm-wave front-ends
Autor:
Jean Godin, Cristell Maneux, Brice Grandchamp, François Marc, Muriel Riet, Sudip Ghosh, Thomas Zimmer, Virginie Nodjiadjim, G. A. Koné, Jean-Yves Dupuy
Publikováno v:
Microelectronics Reliability. 51:1736-1741
The reliability of InP/InGaAs DHBT under high collector current densities and low junction temperatures is analyzed and modeled. From the Gummel characteristics, we observe several types of device degradation, resulting from the long term changes of
Autor:
François Marc, Jean Godin, Brice Grandchamp, Nathalie Labat, Thomas Zimmer, Virginie Nodjiadjim, Muriel Riet, G. A. Koné, Cristell Maneux, C. Hainaut
Publikováno v:
Microelectronics Reliability. 51:1730-1735
We report on the reliability of InGaAs/InP DHBT technology which has applications in very high-speed ICs (over 100 Gbits/s). This work presents the results of accelerated aging tests under thermal and electrical stresses performed on HBT up to 2000 h
Autor:
C. Hainaut, François Marc, Jean Godin, G. A. Koné, Cristell Maneux, Virginie Nodjiadjim, Brice Grandchamp, Nathalie Labat, Thomas Zimmer
Publikováno v:
Microelectronics Reliability. 50:1548-1553
We report on the reliability of InP HBT technology which has applications in very high-speed ICs. This work presents the storage accelerated aging tests results performed on InP/InGaAs HBT at stress temperatures of 180, 210 and 240 °C up to 3000 h.
Autor:
Seonho Seok, M. Arias Campo, Winfried Simon, Robert Malmqvist, A. Gustafsson, Tauno Vähä-Heikkilä, Nathalie Rolland, Brice Grandchamp, M. Fryziel, P. Rantakari, Markku Lahti, L. Baggen
Publikováno v:
Malmqvist, R, Gustafsson, A, Simon, W, Campo, M A, Baggen, L, Grandchamp, B, Seok, S, Fryziel, M, Rolland, N, Lahti, M, Rantakari, P & Vähä-Heikkilä, T 2015, An RF-MEMS based SP4T switched LNA MMIC used in a 24 GHz beam-steering antenna module . in 10th European Microwave Integrated Circuits Conference (EuMIC) . IEEE Institute of Electrical and Electronic Engineers, pp. 329-332, 10th European Microwave Integrated Circuits Conference, EuMIC 2015, Paris, France, 7/09/15 . https://doi.org/10.1109/EuMIC.2015.7345136
This paper presents an RF-MEMS SP4T switched LNA MMIC used in a 24 GHz beam-steering antenna module. The SP4T LNA has a measured gain of 10-16 dB at 16-30 GHz (NF=2.6-3.0 dB at 16-26 GHz) with up to 37 dB of isolation at 24 GHz when one of the four M