Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Brice Arrazat"'
Publikováno v:
Journal of Materials Science. 46:6111-6117
RF MEMS (Radio Frequency Micro Electro Mechanical System) switches are promising devices but their gold-on-gold contacts, assimilated for this study to a sphere/plane contact, represent a major reliability issue. A first step toward understanding fai
Publikováno v:
Matériaux & Techniques. 99:245-252
La duree de vie du contact des micro-commutateurs MEMS (micro electro mechanical systems) limite leur competitivite. Le materiau de contact generalement utilise, sous forme d’un film mince, est l’or. Les principales causes de defaillance sont lie
Autor:
Brice Arrazat, Sylvain Blayac, Pascal Fornara, Sebastian Orellana, Pierre Montmitonnet, Karim Inal, Christian Rivero
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩
International audience; A new concept of a thermo-mechanical lateral switch activation is proposed. Embedded in standard aluminium BEOL (Back End Of Line), it is fully integrated in CMOS technology. The simplicity of this low cost one-mask fabricatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a12ece74956bffc8363f2efa5389f83a
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180626
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180626
Autor:
Sebastian Orellana, A. Di Giacomo, Pascal Fornara, Brice Arrazat, Karim Inal, Christian Rivero
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2014, 120, pp.41-46. ⟨10.1016/j.mee.2013.12.013⟩
Microelectronic Engineering, Elsevier, 2014, 120, pp.41-46. ⟨10.1016/j.mee.2013.12.013⟩
MAM2013, March 10-13, Leuven, Belgium; International audience; In the context of Back-End of Line (BEoL) roadmap, dimension reduces, density integration increases and new materials are introduced. These points associated to manufacturing thermal budg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dd4e5fb9b6c77a372a15a858b0915dbb
https://hal-mines-paristech.archives-ouvertes.fr/hal-00932762
https://hal-mines-paristech.archives-ouvertes.fr/hal-00932762
Autor:
Sylvain Blayac, Karim Inal, S. Orellana, Christian Rivero, Brice Arrazat, Pierre Montmitonnet, A. Di Giacomo, Pascal Fornara
Publikováno v:
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems-EuroSimE 2014
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p.-ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p.-ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩
International audience; A freestanding cross-shaped structure designed as a planar rotation stress sensor [1], [2], [3] is manufactured using standard CMOS technology (Complementary Metal-Oxide-Semiconductor). The fabrication process induces thermal
Autor:
Pascal Fornara, Brice Arrazat, Karim Inal, S. Orellana, Sylvain Blayac, Christian Rivero, Pierre Montmitonnet, Antonio di-Giacomo
Publikováno v:
DTIP 2014-Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700-ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700-ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩
International audience; A metallic in-situ stress sensor is modified to address electrical polarization and thus to locally heat this sensor by Joule effect. By coupling SEM electrical nano-probing with analytical modeling and multiphysics Finite Ele
Publikováno v:
Proceedings of Tansducers 2013 and Eurosensors XXVII
Tansducers and Eurosensors XXVII
Tansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain
Tansducers and Eurosensors XXVII
Tansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain
International audience; Contact material and more precisely surface properties are a major issue for RF MEMS ohmic switch reliability. Shallow ion implantation of boron and nitrogen on gold thin film is investigated to increase surface hardness with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::215b959444da59b1a77e87233caa8bef
https://hal-emse.ccsd.cnrs.fr/emse-00840099/file/Arrazat_Transducers2013.pdf
https://hal-emse.ccsd.cnrs.fr/emse-00840099/file/Arrazat_Transducers2013.pdf
Autor:
Brice Arrazat, Karim Inal
Publikováno v:
Frottement, usure et lubrification.
Afin d'etudier la tribologie des couches minces d'or, des experiences de nano-indentation spherique aux faibles forces sont couplees a des traitements d'images realisees au microscope a force atomique. Ainsi, l'evolution des forces d'adhesion, et don
Publikováno v:
2011 IEEE 57th Holm Conference on Electrical Contacts (Holm).
MEMS ohmic switches have demonstrated interesting performances due in part to their low contact resistance which depends on multiple contributions, one amongst them is the roughness of the contact area. In fact, the contact area is composed by cluste
Autor:
Fabrice Nemouchi, Jean-Paul Barnes, Magali Putero, S. Descombes, Brice Arrazat, Dominique Mangelinck, János L. Lábár, Loeizig Ehouarne, Olivier Kermarrec, Yves Morand, V. Carron, Yves Campidelli
Publikováno v:
ECS Transactions
ECS Transactions, 2007, 6 (16), pp.49-59. ⟨10.1149/1.2812896⟩
ECS Transactions, Electrochemical Society, Inc., 2007, 6 (16), pp.49-59. ⟨10.1149/1.2812896⟩
ECS Transactions, 2007, 6 (16), pp.49-59. ⟨10.1149/1.2812896⟩
ECS Transactions, Electrochemical Society, Inc., 2007, 6 (16), pp.49-59. ⟨10.1149/1.2812896⟩
In this paper, we report on the solid state reactions of Ni thin films (6nm to 12nm) deposited on Ge (001). Especially, the influence of the substrate dopants (As and BF2) is investigated. TEM and SIMS analyses point out the presence of an additional
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::da90827a326709ee92cc8c5a6db13b1d
https://hal.science/hal-01951271
https://hal.science/hal-01951271