Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Brian Zufelt"'
Autor:
James Aarested, Brian Zufelt
Publikováno v:
2018 World Engineering Education Forum - Global Engineering Deans Council (WEEF-GEDC).
Over the last decade, the cost of space access has dramatically decreased with the creation of the CubeSat standard. The CubeSat standard defines the structural requirements for an on-orbit deployer and satellite to be placed into orbit. The average
Publikováno v:
2014 IEEE Radiation Effects Data Workshop (REDW).
Modest total dose in low earth orbit and short cube sat missions provide an opportunity for using commercial electronics. We present the results of high and low dose rate testing of candidate commercial microcircuits.
Publikováno v:
2012 IEEE Aerospace Conference.
In terms of time and budget, integration is a significant time-consuming component of spacecraft development. While many useful COTS spacecraft components are available, interfacing and controlling these components in an integrated satellite system r
Autor:
Keith Avery, Donald Elkins, David Alexander, Jeffery Finchel, Brian Zufelt, Richard Netzer, Jesse Mee, William Kemp
Publikováno v:
2011 IEEE Radiation Effects Data Workshop.
CubeSats are increasingly important for space research. Their low orbits and short mission durations permit using electronics with modest radiation failure thresholds. Total ionizing dose irradiation results are presented for microelectronics interes
Publikováno v:
Infotech@Aerospace 2011.
The Space Plug-and-play Architecture (SPA) concept of rapid satellite development has progressed exponentially over the past several years. The team at the Configurable Space Microsystems Innovations and Applications Center (COSMIAC) in conjunction w
Autor:
Dan Muse, Michael D. Irwin, Cassie Gutierrez, Rudy Salas, Ryan B. Wicker, Brian Zufelt, Eric MacDonald, Mike Newton, Gustavo Hernandez, Kenneth Church, Richard Olivas
Publikováno v:
Scopus-Elsevier
Fabricating entire systems with both electrical and mechanical content through on-demand 3D printing is the future for high value manufacturing. In this new paradigm, conformal and complex shapes with a diversity of materials in spatial gradients can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d233a39f7d80b7f4c9cc7cf30ed79ee8
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