Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Brian Shieh"'
Autor:
Fanny Zhao, Yapei Zeng, Hao Wu, Junquan Chen, Guoming Yang, Li Zhen, Brian Shieh, S. W. Ricky Lee
Publikováno v:
2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS).
Autor:
Fanny Zhao, Junquan Chen, Hao Wu, Yapei Zeng, Guoshuai Dong, Guoming Yang, Brian Shieh, S. W. Ricky Lee
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS).
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Optical characteristics and service life of the Germicidal-UVC (GUVC) low-pressure Hg lamp and the Far-UVC KrCl excimer lamp (FUVC excilamp) were investigated. The results showed that UV irradiance at the center of the FUVC excilamp and the GUVC lamp
Publikováno v:
2020 17th China International Forum on Solid State Lighting & 2020 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS).
The measurement of the junction temperature of light emitting diodes (LEDs) has been crucial for the thermal management. It is more important for the applications of the ultra-violet light emitting diode (UVLED) with a low efficiency generating more
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Infrared (IR) and thermocouple (TC) measurements of the light emission surface of white, blue, red and green LEDs are demonstrated using Transient Thermal Tester (T3Ster). It is shown that the IR measurement could obtain a more accurate result which
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
The major hurdle to the implementation of full-color mini/micro-LED display is the mass transfer of red-green-blue (RGB) LED chips, which leads to low yield and high cost of full-color mini/micro-LED display. To overcome this issue, an alternative em
Publikováno v:
2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS).
The junction temperature of LEDs is important for its life, reliability and efficacy. The existing transient measurement method of the junction temperature of using transient thermal tester (T3ster) based on the time-resolved measuring with a constan
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
An IR vertical-cavity surface-emitting laser (VCSEL) with a peak wavelength 940nm for ToF/Flood applications is characterized by the empirical modelling. This paper presents a novel approach to predict pulsed junction temperature rise of VCSELs using
Publikováno v:
2018 20th International Conference on Electronic Materials and Packaging (EMAP).
Phosphor-converted light emitting diodes (pc-WLEDs) have been a major approach to achieve white light for general lighting. Phosphor, serving as a color converter, plays an important role determining the chromatic and optical performance of WLEDs. Cu