Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Brian Samuel Beaman"'
Autor:
Chris Steffen, Hongqing Zhang, Kevin M. McIlvain, Victor Mahran, Zhineng Fan, Roc Lv, Zhaoqing Chen, Biao Cai, Luis Fukazawa, Brian Samuel Beaman, Junyan Tang, Kyle Giesen
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Differential DIMM (DDIMM) is being defined in JEDEC and uses OMI as a host interface with the data transfer rate being specified at 25.6Gb/s at present and at 51.2Gb/s in the future. A prior 2019∼20 study [13] of full channel simulation and electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::805e6c57449ebe1bf4bf3156d09542fa
https://doi.org/10.1109/ectc32696.2021.00207
https://doi.org/10.1109/ectc32696.2021.00207
Autor:
Wiren D. Becker, Daniel M. Dreps, Pavel Roy Paladhi, Brian Samuel Beaman, Yanyan Zhang, Jose A. Hejase, Junyan Tang, Daniel Rodriguez, Sungjun Chun
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
A comprehensive signal integrity model to hardware correlation study on an improved, 44 Gb/s capable, hybrid land grid array (HLGA) socket connector design is presented. The connector only design SI performance is shown through 3D electromagnetic (EM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18caab087dcff7de491f99354276ba92
https://doi.org/10.1109/epeps48591.2020.9231393
https://doi.org/10.1109/epeps48591.2020.9231393
Autor:
Megan Nguyen, Brian Samuel Beaman, Dale Becker, Kevin M. McIlvain, Zhineng Fan, Junyan Tang, Biao Car, Abhijit Wander, Glen A. Wiedemeier, Hongqing Zhang, Sungjun Chun, Daniel M. Dreps, Brian J. Connolly, Zhaoqin Chen, Yifan Huang, Jose A. Hejase, Victor Mahran, Kyle Giesen, Baughen Devon
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
DDR5 Differential DIMM (DDIMM) is being defined in JEDEC and uses OMI as a host interface with the data transfer rate per data differential pair being specified at 25.6Gb/s minimum at present and at 51.2Gb/s maximum in the future. This is a significa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e9136c15f300b3bc939a6c76c3ccc5b
https://doi.org/10.1109/ectc32862.2020.00158
https://doi.org/10.1109/ectc32862.2020.00158
Autor:
Brian Samuel Beaman, Jean Audet
Publikováno v:
International Symposium on Microelectronics. 2017:000659-000662
Land grid array (LGA) sockets are commonly used for industry standard and custom microprocessors to meet the increased performance challenges for a variety of server applications. Along with the need for increased high speed signaling capabilities co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37c6421247e744b2684d16dfc0f22307
https://doi.org/10.4071/isom-2017-poster3_002
https://doi.org/10.4071/isom-2017-poster3_002
Publikováno v:
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
This paper presents an improved hybrid land grid array socket connector design enabling high speed bus signaling data rates up to 50Gb/s. Observed limitations in an existing connector such as impedance mismatches and crosstalk are treated and improve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ba8387431a97d41495100b763af29b9
https://doi.org/10.1109/epeps.2017.8329761
https://doi.org/10.1109/epeps.2017.8329761
Autor:
Brian Samuel Beaman, Shawn Canfield, William L. Brodsky, Mark K. Hoffmeyer, Arvind K. Sinha, John G. Torok, Yuet-Ying Yu, Jason R. Eagle, Theron L. Lewis
Publikováno v:
International Symposium on Microelectronics. 2014:000550-000560
Recent high-end server design trends have continued to challenge electronic packaging engineers to design and integrate larger form factor land grid array (LGA) attached modules within their assemblies. These trends have included the application of l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3303afc204d1a8016e61cb944560649
https://doi.org/10.4071/isom-wa65
https://doi.org/10.4071/isom-wa65
Autor:
Sungjun Chun, Brian Samuel Beaman, Wiren D. Becker, Ryan Nett, Jason R. Eagle, Jon A. Casey, Steven P. Ostrander, Daniel M. Dreps, Jose A. Hejase
Publikováno v:
IBM Journal of Research and Development. 62:12:1-12:10
The first-level package that contains the IBM POWER9 processor chip is designed to achieve the high computational performance needed for cognitive systems in a cost-effective design. The throughput data bandwidth of the POWER9 package for high-end sc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5838db857ab06515a6f61c9e276c541a
https://doi.org/10.1147/jrd.2018.2847178
https://doi.org/10.1147/jrd.2018.2847178
Autor:
Brian Samuel Beaman
Publikováno v:
2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89195a0d5505fe12bb62a1c2324d3b12
https://doi.org/10.1109/holm.2010.5619458
https://doi.org/10.1109/holm.2010.5619458
Autor:
Brian Samuel Beaman
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
Recent trends for industry standard microprocessors show a transition from using micro PGA (pin grid array) sockets to using LGA (land grid array) sockets to meet the increased performance challenges for new server applications. These new industry st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b13cfac096dc20559620d4b0317bbbc8
https://doi.org/10.1115/ipack2007-33067
https://doi.org/10.1115/ipack2007-33067
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
Elastomeric connectors are a relatively new technology compared with conventional connector systems. A wide variety of elastomeric connectors are available today to meet the interconnection requirements for many different electronic packaging applica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d85e18cf1ac20dd0f82fc193f0f73ea8
https://doi.org/10.1109/ectc.1993.346810
https://doi.org/10.1109/ectc.1993.346810