Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Brian R. Sundlof"'
Autor:
Masahiro Fukui, Charles F. Carey, Teruya Fujisaki, Hilton T. Toy, Kenji Terada, Masaaki Harazono, Sushumna Iruvanti, Tomoyuki Yamada, Brian R. Sundlof, Yi Pan, Kamal K. Sikka, Charlie Reynolds, Rebecca N. Wagner
Publikováno v:
International Symposium on Microelectronics. 2014:000068-000073
In organic packages, large die and large laminate body sizes are susceptible to CTE (coefficient of thermal expansion) mismatch driven warpage, stresses and strains, which can result in C4 white bumps, micro Ball Grid Array (BGA) interconnection issu
Autor:
Hsichang Liu, Scott Alan Moore, Masahiro Fukui, Kenji Terada, Brian R. Sundlof, Masaaki Harazono, Tomoyuki Yamada, Teruya Fujisaki, Hongqing Zhang, Sushumna Iruvanti, Jean Audet, Charles L. Reynolds, Yi Pan
Publikováno v:
International Symposium on Microelectronics. 2013:000538-000545
This paper describes a Chip Scale Package (CSP) development project and evaluation of the corresponding organic laminate material. Chip scale packaging can combine the strengths of various packaging technologies, such as the large size and performanc
Autor:
Mark C. H. Lamorey, Timothy H. Daubenspeck, R. Bisson, Thomas A. Wassick, K. Smith, Hosadurga Shobha, Dimitri R. Kioussis, Griselda Bonilla, J. Wright, S. Tetreault, David B. Stone, I. Paquin, Timothy M. Shaw, E. Misra, Gordon C. Osborne, Brian R. Sundlof, X.-H. Liu, Christopher D. Muzzy, S. S. Bouchard, David L. Questad
Publikováno v:
2016 IEEE International Reliability Physics Symposium (IRPS).
This study examines different approaches to determining the chip failure rate that occurs due to dielectric cracking under C4 sites during chip joining. We show that testing of the strength of individual C4s by a single bump shear technique gives a s
Autor:
Timothy H. Daubenspeck, Timothy M. Shaw, X.-H. Liu, Christopher D. Muzzy, Griselda Bonilla, S. S. Bouchard, Thomas A. Wassick, David B. Stone, David L. Questad, Brian R. Sundlof, Hosadurga Shobha, Dimitri R. Kioussis, I. Paquin, E. Misra, Gordon C. Osborne, J. Wright, S. Tetreault, R. Bisson, Mark C. H. Lamorey
Publikováno v:
2015 IEEE International Integrated Reliability Workshop (IIRW).
The paper examines the factors that affect the formation of delaminations under C4 joints during chip joining. Through multiscale finite element modeling and chip joining experiments we find that two important parameters determining the susceptibilit
Publikováno v:
Solid State Ionics. 182:1-7
The reaction between Fe foil and a disc of ilmenite solid solution (Co-0.48 Ni-0.52) TiO3 was studied at 1273 K. At the metal/oxide interface, the displacement reaction, Fe + (Co,Mg)TiO3 = Co + (Fe,Mg)TiO3 occurs, resulting in an ilmenite solid solut
Publikováno v:
CICC
IBMpsilas C4 interconnection technology has continuously evolved over a period of forty years, i.e. from evaporation, to electroplating to C4NP, a C4 New Process. IBMpsilas initial C4NP efforts are focused on Sn-based Pb-free solder technology, in li
Autor:
Brian R. Sundlof, William M. Carty
Publikováno v:
Materials & Equipment/Whitewares: Ceramic Engineering and Science Proceedings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4a1831dd81d9fb2c1372007fd69a398
https://doi.org/10.1002/9780470294543.ch15
https://doi.org/10.1002/9780470294543.ch15
Conference
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Periodical
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