Zobrazeno 1 - 10
of 42
pro vyhledávání: '"Brian R. Burg"'
Autor:
Oriane Chaput, Derek Solt, Sivaprasad Sukavaneshvar, Nathalie Fenouil, Brian R. Burg, Philippe Pouletty, Stephan Haulon, Dominique Fabre
Publikováno v:
ASAIO journal (American Society for Artificial Internal Organs : 1992). 68(10)
Late and persistent type II endoleaks (EL2) following Endovascular Aneurysm Repair (EVAR) have been recognized as an independent and significant risk factor for aneurysm sac growth and secondary procedures. Solutions are available for treatment, with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5981ecb244abef4c510de91fca39be3f
https://pubmed.ncbi.nlm.nih.gov/36194096
https://pubmed.ncbi.nlm.nih.gov/36194096
Publikováno v:
Handbook of 3D Integration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a0f4572a7f8c361db327353328b76ff
https://doi.org/10.1002/9783527697052.ch19
https://doi.org/10.1002/9783527697052.ch19
Publikováno v:
Transport in Porous Media. 125:173-192
The thermal and electrical transport capabilities of materials in electronic packaging are key to supporting high-performance microelectronic systems. In composite and hybrid materials, both of these transport capabilities are limited by contact resi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4871eed9a1741c6390eabb744a2ad654
https://doi.org/10.1007/s11242-018-1112-4
https://doi.org/10.1007/s11242-018-1112-4
Effects of radiative forcing of building integrated photovoltaic systems in different urban climates
Publikováno v:
Solar Energy. 147:399-405
Recent years have witnessed a remarkable reduction in solar-panel costs, such that low-efficiency, low-cost photovoltaics (PV) currently prevail over more complex, high-efficiency technologies. Although solar-energy-generating installations provide a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ce3b4646db9fde4a49e20fc4a035e3f6
Autor:
Xi Chen, Rahel Straessle, Thomas Brunschwiler, André R. Studart, Brian R. Burg, Jonas Zurcher, Severin Zimmermann
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1785-1795
Efficient heat removal from integrated circuits arranged vertically in 3-D chip stacks requires thermally conductive underfill materials. The low-heat-transport performance of traditional capillary underfills can be improved by percolating the therma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32cd86fbe4f06b9b27d2d4bcc78c283d
https://doi.org/10.1109/tcpmt.2016.2614537
https://doi.org/10.1109/tcpmt.2016.2614537
Autor:
Brian R. Burg, Jonas Zurcher, Severin Zimmermann, Bernhard Wunderle, Florian Schindler-Saefkow, Gerd Schlottig, Rahel Stässle, Luca Del Carro, Thomas Brunschwiler, Uwe Zschenderlein
Publikováno v:
Journal of Electronic Packaging. 139
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::678c45d95cd15a77c7763c299f5b2d21
https://doi.org/10.1115/1.4035707
https://doi.org/10.1115/1.4035707
Autor:
Brian R. Burg, Florian Schindler-Saefkow, Severin Zimmermann, Uwe Zschenderlein, Gerd Schlottig, Bernhard Wunderle, Jonas Zurcher, Thomas Brunschwiler, Rahel Stässle, Luca Del Carro
Publikováno v:
Journal of Electronic Packaging. 138
Heat dissipation from three-dimensional (3D) chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance and thereby the thermal gr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96800b89577e414e2c6241b052561973
https://doi.org/10.1115/1.4034927
https://doi.org/10.1115/1.4034927
Autor:
Bernhard Wunderle, Tuhin Sinha, Mario Baum, Brian R. Burg, Xi Chen, Christian Hofmann, Florian Schindler-Saefkow, Gerd Schlottig, Rahel Strassle, Thomas Brunschwiler, Remi Pantou, Severin Zimmermann, Uwe Zschenderlein, Albert Achen, Sridhar Kumar, Jonas Zurcher, Marie Haupt
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Heat dissipation from 3D chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance and thereby the thermal gradients, this public
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5255523b0fc271354fb2ba7356af0b7a
https://doi.org/10.1109/itherm.2016.7517541
https://doi.org/10.1109/itherm.2016.7517541
Autor:
Niklas C. Schirmer, Brian R. Burg, Dimos Poulikakos, Martin Schmid, Carmen Kullmann, Timo Schwamb
Publikováno v:
Advanced Materials. 22:4701-4705
The printing of liquids and colloids has a large range of applications and often relies on the ability to eject in a controlled manner very small amounts of liquid from the opening of a capillary. To this end, in the conventional on-demand microprint
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c3f17d5206ec27e523089e1103ea45db
https://doi.org/10.1002/adma.201001355
https://doi.org/10.1002/adma.201001355
Publikováno v:
Langmuir. 26:10419-10424
The dielectrophoretic separation of individual metallic single-walled carbon nanotubes (SWNTs) from heterogeneous solutions and their simultaneous deposition between electrodes is achieved and confirmed by direct electric transport measurements. Out-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b2d8b1af2a154d587d454787b83a617
https://doi.org/10.1021/la1013158
https://doi.org/10.1021/la1013158