Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Brian F. Donovan"'
Autor:
Enrique D. Gomez, Zhe Chen, Tian Zhang, Seong H. Kim, Bing Zhang, Ziyu Liu, Wengchang Lu, Ronald J. Warzoha, Jerry Bernholc, Xin Chen, Qiyan Zhang, Qiming Zhang, Brian F. Donovan
Publikováno v:
Matter. 4:2448-2459
Summary Polymers with high dielectric breakdown strength (Eb) over a broad temperature range are vital for many applications. The presence of weak points, such as voids and free volume, severely limit the Eb of many high-temperature polymers. Here, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a40e0cee9102ac92c4c2f85c2d8f40f3
https://doi.org/10.1016/j.matt.2021.04.026
https://doi.org/10.1016/j.matt.2021.04.026
Autor:
Edward P. Gorzkowski, Ashutosh Giri, Tyler Cosby, Ronald J. Warzoha, Adam A. Wilson, Andrew J. Borgdorff, Nicholas T. Vu, Eric A. Patterson, Brian F. Donovan
Publikováno v:
Macromolecules. 53:11089-11097
Thin-film (5–20 μm) polymer dielectrics are a critical component in high energy density capacitors. Understanding thermal transport in these materials is critical to addressing thermally enabled di...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e6a43c2b9357de324ee911205c9f217
https://doi.org/10.1021/acs.macromol.0c01243
https://doi.org/10.1021/acs.macromol.0c01243
Autor:
Brian F. Donovan, Ronald J. Warzoha
Publikováno v:
Physical review letters. 128(12)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9672d26fabc47b5f9a46cd7f8c6fdeb5
https://pubmed.ncbi.nlm.nih.gov/32142352
https://pubmed.ncbi.nlm.nih.gov/32142352
Publikováno v:
International Journal of Heat and Mass Transfer. 130:874-881
Interfaces play a critical role in heat dissipation for electronics packaging applications, thermoelectric energy conversion, data center cooling and renewable energy systems architectures. They are particularly influential as device length scales ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::767ac45b59642b40bbbcdbd9fe7d518e
https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099
https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099
Autor:
Brian F. Donovan, Ashutosh Giri, David H. Olson, Patrick E. Hopkins, John A. Tomko, S. M. O’Malley, John T. Gaskins
Publikováno v:
Langmuir. 35:2106-2114
Understanding the effects and limitations of solid/liquid interfaces on energy transport is crucial to applications ranging from nanoscale thermal engineering to chemical synthesis. Until now, the majority of experimental evidence regarding solid/liq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ac29d3427c3c583d97c876a73e8768a8
https://doi.org/10.1021/acs.langmuir.8b03675
https://doi.org/10.1021/acs.langmuir.8b03675
Publikováno v:
Review of Scientific Instruments. 93:084904
Time delayed pump–probe measurement techniques, such as Time Domain Thermoreflectance (TDTR), have opened up a wealth of opportunities for metrology at ultra-fast timescales and nanometer length scales. For nanoscale thermal transport measurements,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::389e898657580f54508f69a79502bc61
https://doi.org/10.1063/5.0089075
https://doi.org/10.1063/5.0089075
Autor:
Adam A. Wilson, Samuel Graham, Ronald J. Warzoha, Patrick E. Hopkins, Darshan G. Pahinkar, Zhiting Tian, Brian F. Donovan, Sukwon Choi, Laura B. Ruppalt, Nazli Donmezer, Ashutosh Giri, Jingjing Shi
Publikováno v:
Journal of Electronic Packaging. 143
This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hiera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e25ce67d00d927182c45f72416a6ea31
https://doi.org/10.1115/1.4049293
https://doi.org/10.1115/1.4049293
Autor:
Matteo Alberghini, Gang Chen, Pietro Asinari, Richard M. Ogsood, Svetlana V. Boriskina, Volodymyr F. Korolovych, Ronald J. Warzoha, Evgeny V. Morozov, Andrey E. Miroshnichenko, Brian F. Donovan, Haroldo T. Hattori, L. Marcelo Lozano, Daeyeon Lee, Matteo Fasano, Yi Huang
Publikováno v:
OSA Advanced Photonics Congress (AP) 2020 (IPR, NP, NOMA, Networks, PVLED, PSC, SPPCom, SOF).
We will discuss new metamaterials with tunable photon and phonon transport properties achieved by either sculpting the meso-scale structure of polymers or using polymers to sculpt the internal structure of nanoparticle arrays.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55756e3ab7c26cf944f2abede3b20d96
https://doi.org/10.1364/noma.2020.noth1c.1
https://doi.org/10.1364/noma.2020.noth1c.1
Autor:
Adam A. Wilson, Brian F. Donovan, Ronald J. Warzoha, Trent Perry, Longnan Li, Andrew N. Smith, E. Getto, Nenad Miljkovic, Nicholas T. Vu
In this work, we develop a numerical fitting routine to extract multiple thermal parameters using frequency-domain thermoreflectance (FDTR) for materials having non-standard, non-semi-infinite geometries. The numerical fitting routine is predicated o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b997d6b14971a36050904adbc7500e1c
Autor:
Chester J. Szwejkowski, Mohammadhosein Ghasemi Baboly, Susan B. Rempe, Jeffrey L. Braun, Ashutosh Giri, Mirza Elahi, Zayd C. Leseman, Seyedhamidreza Alaie, Drew F. Goettler, Ying Bing Jiang, Dalaver H. Anjum, Patrick E. Hopkins, Brian F. Donovan, John T. Gaskins, Saharoui Chaieb
Publikováno v:
ACS Applied Materials & Interfaces. 10:37679-37684
Focused ion beam (FIB) technology has become a valuable tool for the microelectronics industry and for the fabrication and preparation of samples at the micro/nanoscale. Its effects on the thermal transport properties of Si, however, are not well und
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80d0494cd00d5c0c9b4ecb9c9d2352c9
https://doi.org/10.1021/acsami.8b11949
https://doi.org/10.1021/acsami.8b11949