Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Brian D. Griesbach"'
Autor:
Mike Petras, Vance H. Adams, Brian D. Griesbach, Tom Kropewnicki, Dina H. Triyoso, Doug Booker, Thuy B. Dao, Rode R. Mora
Publikováno v:
Proceedings of 2010 International Symposium on VLSI Design, Automation and Test.
Thermo-mechanical stress of tungsten-filled (W-fill) through-silicon-via (TSV) is strongly depending on via shape, size and inter-via spacing, which places constraints on TSV design, including 2-D integrated circuit layout and 3-D structure profile.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f62768624a111ddbc85d0a4eb0c0f699
https://doi.org/10.1109/vdat.2010.5496677
https://doi.org/10.1109/vdat.2010.5496677
