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Autor:
Qiang Huang, John Dukovic, Sunny Chiang, Xiaoyan Shao, James J. Kelly, O. van der Straten, Brett Baker O'Neal, Tuan Vo
Publikováno v:
ECS Meeting Abstracts. :1897-1897
The morphology of thin layers of Cu electrodeposited on 300 mm Ru substrates (deposited by plasma enhanced atomic layer deposition or PEALD) is studied. To reduce the terminal effect, a layer of physical vapor deposited (PVD) Cu is employed beneath t