Numerical modeling of warpage induced in QFN array molding process

Autor: Yang, D.G., Jansen, K.M.B., Ernst, L.J., Zhang, G.Q., van Driel, W.D., Bressers, H.J.L., Janssen, J.H.J.

Publikováno v: In Microelectronics Reliability 2007 47(2):310-318

Virtual qualification of moisture induced failures of advanced packages

Autor: van Gils, M.A.J., van Driel, W.D., Zhang, G.Q., Bressers, H.J.L., van Silfhout, R.B.R., Fan, X.J., Janssen, J.H.J.

Publikováno v: In Microelectronics Reliability 2007 47(2):273-279

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

Autor: Yang, D.G., Jansen, K.M.B., Ernst, L.J., Zhang, G.Q., Bressers, H.J.L., Janssen, J.H.J.

Publikováno v: In Microelectronics Reliability 2007 47(2):233-239

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Autor: Yang, D.G., Zhang, G.Q., Ernst, L.J., van 't Hof, C., Caers, J.F.J.M., Bressers, H.J.L., Janssen, J.H.J.

Publikováno v: IEEE Transactions on Components and Packaging Technologies, 26 (2) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies]

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=narcis______::f08e2794d52b984f5eba0afcce8a2433
http://resolver.tudelft.nl/uuid:99943327-4858-44b2-9cbc-045c2f154c46

Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation.

Autor: Ernst, L.J., Jansen, K.M.B., Saraswat, M., van 't Hof, C., Zhang, G.Q., Yang, D.G., Bressers, H.J.L.

Publikováno v: 2006 7th International Conference on Electronic Packaging Technology; 2006, p1-7, 7p