Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Bressers, A. M."'
Autor:
Wagemans, A. M. A., Lantman-de Valk, H. M. J. van Schrojenstein, Proot, I. M., Bressers, A. M., Metsemakers, J., Tuffrey-Wijne, I., Groot, M., Curfs, L. M. G.
Publikováno v:
Journal of Intellectual Disability Research, 61, 3, pp. 245-254
Journal of Intellectual Disability Research, 61, 245-254
Journal of Intellectual Disability Research, 61(3), 245-254. Wiley
Journal of Intellectual Disability Research, 61, 245-254
Journal of Intellectual Disability Research, 61(3), 245-254. Wiley
Item does not contain fulltext BACKGROUND: Not much is known about Do-Not-Attempt-Resuscitation (DNAR) decision-making for people with intellectual disabilities (IDs). The aim of this study was to clarify the problems and pitfalls of non-emergency DN
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::15d9b9f646aa56d27f90118c03d42b77
https://eprints.kingston.ac.uk/id/eprint/36112/1/Tuffrey-Wijne-I-36112-VoR.pdf
https://eprints.kingston.ac.uk/id/eprint/36112/1/Tuffrey-Wijne-I-36112-VoR.pdf
Autor:
Bullema, J. E., Bressers, P. M. M. C., Oosterhuis, G., Mueller, M., Huis In T Veld, A. J., Fred Roozeboom
Publikováno v:
EMPC-2011-18th European Microelectronics and Packaging Conference, Proceedings
Scopus-Elsevier
18th European Microelectronics and Packaging Conference, EMPC-2011, 12-15 September 2011, Brighton, Uk
Scopus-Elsevier
18th European Microelectronics and Packaging Conference, EMPC-2011, 12-15 September 2011, Brighton, Uk
3D stacking of integrated circuits is an emerging packaging technology to enable a high degree of functional integration and miniaturization. Footprint reduction in 3D stacking can be achieved by use of Through Silicon Vias (TSV). Creation of TSVs wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::987f25b47c1823ae5cd1502ebcdeeb71
https://research.tue.nl/nl/publications/ef80f618-ced0-4761-8ec2-f25c3ffdabdd
https://research.tue.nl/nl/publications/ef80f618-ced0-4761-8ec2-f25c3ffdabdd
Akademický článek
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