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Autor:
Satyajit Shinde, Garrett Szafman, Bradley Savoy, Jaana S. Rajachidambaram, Chihyun Jung, Shiladitya Chakravorty
Publikováno v:
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In semiconductor manufacturing regular tool monitoring is essential for quality control. For the case of furnace tools tool monitoring is done by processing tool qualification wafers on tools followed with measurements on the wafers. Regular tool qua
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0b586cb7e5c0ee2e6932b0d125352dd
https://doi.org/10.1109/asmc.2018.8373205
https://doi.org/10.1109/asmc.2018.8373205
