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Autor:
Aubert, Thierry, Elmazria, Omar, Assouar, Badreddine, Bouvot, Laurent, Bournebe, Zoumnone, Hehn, Michel, Weber, Sylvain, Oudich, Mourad, Alnot, Patrick
Publikováno v:
IEEE International Ultrasonics Symposium, Sep 2009, Rome, Italy
In this paper, we report on the use of tantalum and iridium as adhesion layers for platinum electrodes used in high temperature SAW devices based on langasite substrates (LGS). Unlike iridium, tantalum exhibits a great adhesive strength, and a very l
Externí odkaz:
http://arxiv.org/abs/1905.00695