Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Bouchra Hassoune-Rhabbour"'
Autor:
Olivier Tramis, Nicolas Merlinge, Bouchra Hassoune-Rhabbour, Marina Fazzini, Valérie Nassiet
Publikováno v:
ACS Omega, Vol 8, Iss 41, Pp 37842-37851 (2023)
Externí odkaz:
https://doaj.org/article/13de687011af42a788f68fff66046f1a
Autor:
Camille Gillet, Wilfried Splawski, Florian Aguirre, Bouchra Hassoune-Rhabbour, Tatiana Tchalla, Valérie Nassiet
Publikováno v:
Journal of Composite Materials. 57:1495-1510
Moisture content measurements are performed on scrapped Outlet Guide Vanes (OGV) that have operated in different climates. These measurements are made by three Karl Fischer titration methods. The results are separated into two parts. On one side, a c
Autor:
Camille Gillet, Ferhat Tamssaouet, Bouchra Hassoune-Rhabbour, Tatiana Tchalla, Valérie Nassiet
Publikováno v:
Polymers. 14(14)
The hygrothermal ageing of epoxy resins and epoxy matrix composite materials has been studied many times in the literature. Models have been developed to represent the diffusion behaviour of the materials. For reversible diffusions, Fick, Dual–Fick
Autor:
Benjamin Paul, Laurence Bailly, Didier Bégué, Christine Lartigau-Dagron, Bouchra Hassoune-Rhabbour, Valérie Nassiet
Publikováno v:
Polymer Degradation and Stability. 208:110250
Autor:
Camille Gillet, Valérie Nassiet, Fabienne Poncin‐Epaillard, Bouchra Hassoune‐Rhabbour, Tatiana Tchalla
Publikováno v:
Macromolecular Symposia. 405:2100213
Autor:
Camille Gillet, Bouchra Hassoune-Rhabbour, Fabienne Poncin-Epaillard, Tatiana Tchalla, Valérie Nassiet
Publikováno v:
Polymer Degradation and Stability. 202:110023
Autor:
Robert D. Adams, Alireza Akhavan-Safar, Matthias Albiez, Gregory L. Anderson, Ian A. Ashcroft, Alan A. Baker, Ricardo J.C. Carbas, John Comyn, Robert L. Crane, Gary W. Critchlow, Lucas F.M. da Silva, Peter Davies, Klaus Dilger, David A. Dillard, Paul A. Fay, John Hart-Smith, Bouchra Hassoune-Rhabbour, Markku Hentinen, Martin Hildebrand, Björn Källander, Ewen J.C. Kellar, David J. Macon, Eduardo A.S. Marques, José Miguel Martín-Martínez, Stephan Marzi, Aamir Mubashar, Valérie Nassiet, John Newman, Jacques-Alain Petit, Chiaki Sato, Erik Serrano, Magdalena Sterley, Olivier Tramis, Till Vallée, John F. Watts, Hamed Y. Nezhad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a55fe33aab0b31ea83796e5537fe71ce
https://doi.org/10.1016/b978-0-12-819954-1.09991-3
https://doi.org/10.1016/b978-0-12-819954-1.09991-3
From microelectronics to power electronics, adhesive bonding technology is finding more and more important, extended, and diversified applications in electronics packaging. So Conductive adhesives (CAs) and nonconductive adhesives (NCAs) have receive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d18ca62f48523b652a3674001e44d21b
https://doi.org/10.1016/b978-0-12-819954-1.00025-3
https://doi.org/10.1016/b978-0-12-819954-1.00025-3
Publikováno v:
Key Engineering Materials. 498:210-218
There are several models on the relationship structures and properties of the composite fiber / matrix interface [1]. Including literature proposes the development of micromechanical tests suitable for assessing the shear strength of the interface fi
Publikováno v:
Applied Mechanics and Materials. 62:107-116
A method is described for measuring the glass transition temperature (Tg) of epoxy joints bonding ceramic (SiC) substrates. This method is based on the strain measure of a single-lap joint subjected to a temperature variation. The resulting displacem