Zobrazeno 1 - 10
of 521
pro vyhledávání: '"Bouchier, D"'
We achieved ohmic contacts down to 5 K on standard n-doped Ge samples by creating a strongly doped thin Ge layer between the metallic contacts and the Ge substrate. Thanks to the laser doping technique used, Gas Immersion Laser Doping, we could attai
Externí odkaz:
http://arxiv.org/abs/1411.4325
Autor:
Renard, C., Cherkashin, N., Jaffré, A., Molière, T., Vincent, L., Michel, A., Alvarez, J., Connolly, J. P., Kleider, J. -P., Mencaraglia, D., Bouchier, D.
To date, high efficiency multijunction solar cells have been developed on Ge or GaAs substrates for space applications, and terrestrial applications are hampered by high fabrication costs. In order to reduce this cost, we propose a breakthrough techn
Externí odkaz:
http://arxiv.org/abs/1312.3570
Single junction Si solar cells dominate photovoltaics but are close to their efficiency limits. This paper presents ideal limiting efficiencies for tandem and triple junction multijunction solar cells subject only to the constraint of the Si bandgap
Externí odkaz:
http://arxiv.org/abs/1312.2908
Autor:
Aassime, A., Hamouda, F., Richardt, I., Bayle, F., Pillard, V., Lecoeur, P., Aubert, P., Bouchier, D.
Publikováno v:
In Microelectronic Engineering October 2013 110:320-323
Autor:
Vincent, L., Fossard, F., Kociniewski, T., Largeau, L., Cherkashin, N., Hÿtch, M.J., Debarre, D., Sauvage, T., Claverie, A., Boulmer, J., Bouchier, D.
Publikováno v:
In Applied Surface Science 15 September 2012 258(23):9208-9212
Autor:
Renard, C., Boukhicha, R., Gardès, C., Fossard, F., Yam, V., Vincent, L., Bouchier, D., Hajjar, S., Bubendorff, J.L., Garreau, G., Pirri, C.
Publikováno v:
In Thin Solid Films 1 February 2012 520(8):3314-3318
Publikováno v:
In Thin Solid Films 2010 518(9):2542-2545
Autor:
Cammilleri, V.D., Yam, V., Fossard, F., Renard, C., Bouchier, D., Zheng, Y., Fazzini, P.F., Houdellier, F., Hÿtch, M.
Publikováno v:
In Materials Science in Semiconductor Processing 2008 11(5):214-216
Publikováno v:
In Superlattices and Microstructures 2008 44(4):348-353