Zobrazeno 1 - 10
of 59
pro vyhledávání: '"Bosman, Erwin"'
Publikováno v:
In Optical Materials February 2016 52:26-31
Autor:
Missinne, Jeroen, Bosman, Erwin, Van Hoe, Bram, Verplancke, Rik, Van Steenberge, Geert, Kalathimekkad, Sandeep, Van Daele, Peter, Vanfleteren, Jan
Publikováno v:
In Sensors & Actuators: A. Physical October 2012 186:63-68
Autor:
Cauwe, Maarten, Vandevelde, Bart, Nawghane, Chinmay, Van De Slyeke, Marnix, Bosman, Erwin, Verhegge, Joachim, Coulon, Alexia, Heltzel, Stan
Publikováno v:
Journal of Microelectronic & Electronic Packaging; Jul2020, Vol. 17 Issue 3, p79-88, 10p
Autor:
Elmogi, Ahmed, Bosman, Erwin, Kalathimekkad, Sandeep, Teigell Beneitez, Nuria, Missinne, Jeroen, Guindi, Rafik, Van Steenberge, Geert
Publikováno v:
Annual Symposium of the IEEE Photonics Benelux Chapter, Proceedings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______330::0fa928b6591118dede5347cb6a44cc04
https://biblio.ugent.be/publication/4207098/file/4207104
https://biblio.ugent.be/publication/4207098/file/4207104
Autor:
Van Steenberge, Geert, Bosman, Erwin, Missinne, Jeroen, Van Hoe, Bram, Kaur, Kamalpreet, Kalathimekkad, Sandeep, Teigell Beneitez, Nuria, Elmogi, Ahmed
Publikováno v:
European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts
Recent progress on novel photonics packaging concepts will be discussed, allowing for a dense integration of optical waveguides, coupling structures, light sources, detectors, and electronic circuitry. Through the involvement in various European rese
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______330::24ca7902759890f6799fe4c485764b89
https://biblio.ugent.be/publication/4147643
https://biblio.ugent.be/publication/4147643
Publikováno v:
1st International Workshop on Embedded Optical Sensor for Composite Materials, Abstracts
Several concepts for new types of artificial skin with integrated pressure and shear sensors will be discussed, based on a process that allows embedding optical compo-nents into very thin and flexible substrates. A flexible shear sensor foil is devel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______330::7d43ecae34303c6b51afd0ad9ca87058
https://biblio.ugent.be/publication/4170594
https://biblio.ugent.be/publication/4170594
Autor:
Bosman, Erwin
Licht als informatiedrager voor datacommunicatie kende een ongezien succes in de laatste decennia. Wegens de lage verliezen en hoge datasnelheden hebben ze voor het overbruggen van lange afstanden hun elektrische tegenhangers reeds geruime tijd verdr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______330::d4fd36b3ecf7d1c563e9011db052d04c
https://hdl.handle.net/1854/LU-1040193
https://hdl.handle.net/1854/LU-1040193
Publikováno v:
Proceedings of the 2nd International Symposium on Photonic Packaging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______330::1fcc9ab40493505383c315e8a065c948
https://biblio.ugent.be/publication/676497
https://biblio.ugent.be/publication/676497
Publikováno v:
Proceedings of the 2nd International Symposium on Photonic Packaging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______330::72f5f24394845989a7392a7f616c234f
https://biblio.ugent.be/publication/676491/file/676495
https://biblio.ugent.be/publication/676491/file/676495