Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Borislav Bonev"'
Autor:
Anna Stoynova, Borislav Bonev
Publikováno v:
International Journal of Circuits, Systems and Signal Processing. 16:941-947
This paper examines the impact of post-processing of lock-in thermographic measurement data on the ability to detect and characterize in terms of geometric dimensions and location of specific types of defects in MCM-L. A thermal 3D model of a test sp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ae9ef994d3a2e349709e315eed24fca
https://doi.org/10.46300/9106.2022.16.115
https://doi.org/10.46300/9106.2022.16.115
Autor:
Anna Stoynova, Borislav Bonev
Publikováno v:
International Journal of Circuits, Systems and Signal Processing. 16:787-792
This paper discusses the applicability of pulsed and lock-in thermography using Fourier transform processing to diagnose specific types of defects in Multilayer FR-4 Substrates. Digital thermal models of test specimens with different types of defects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b41617f3f3a66059855f02ad370e9234
https://doi.org/10.46300/9106.2022.16.97
https://doi.org/10.46300/9106.2022.16.97
Publikováno v:
2022 XXXI International Scientific Conference Electronics (ET).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ba30fa14d137b0967e253940bba3620
https://doi.org/10.1109/et55967.2022.9920269
https://doi.org/10.1109/et55967.2022.9920269
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb0c7e98cffc4d7d8da507fd680d4794
https://doi.org/10.1109/estc55720.2022.9939431
https://doi.org/10.1109/estc55720.2022.9939431
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95d64da1449e70e419f8dcd7e85b6a0b
https://doi.org/10.1109/isse54558.2022.9812831
https://doi.org/10.1109/isse54558.2022.9812831
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75e905622f3dd068380e200c49901d3f
https://doi.org/10.1109/eptc53413.2021.9663919
https://doi.org/10.1109/eptc53413.2021.9663919
Autor:
Antonio Shopov, Borislav Bonev
Publikováno v:
International Journal of Modeling and Optimization. 9:102-107
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97a73e461dbde6a53e74e00f1befdd9b
https://doi.org/10.7763/ijmo.2019.v9.693
https://doi.org/10.7763/ijmo.2019.v9.693
Autor:
Borislav Bonev, Anna Stoynova
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This article presents an approach to obtain solutions by channelling the electro-thermal (ET) analogy and using an open source electrical circuit simulator to model hidden defects in electronic structures and devices and simulate the thermography mea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f314e7beb8f7918d961eb333c32f0354
https://doi.org/10.1109/isse51996.2021.9467622
https://doi.org/10.1109/isse51996.2021.9467622
Autor:
Borislav Bonev, Anna Stoynova
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
Printed circuit board (PCB) hidden defect analysis from thermographic testing data during their quality control or production may help manufacturers investigate and understand why it actually failed. A significant problem, unexplored in depth is the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5c10659ddbbb1ee8f539b222e231d22
https://doi.org/10.1109/isse51996.2021.9467597
https://doi.org/10.1109/isse51996.2021.9467597
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
In this paper, the thermal behaviour of lithium-ion (LI) batteries at different charging and discharging modes is studied. With the help of infrared thermography is carried out continuous monitoring of the surface temperature distribution under diffe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6be7147b9a683bdde2842a2bd998376
https://doi.org/10.1109/isse51996.2021.9467568
https://doi.org/10.1109/isse51996.2021.9467568