Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Borislav Alexandrov"'
Autor:
Keith Bowman, Dongmin Yoon, Farhana Sheikh, Chia-Hsiang Chen, Hossein Alavi, Anthony L. Chun, Zhengya Zhang, Borislav Alexandrov
Publikováno v:
SiPS
A configurable, channel-adaptive K-best MIMO detector for multi-mode wireless communications that adapts computation to varying channel conditions to achieve high energy-efficiency is presented. An 8-stage configurable MIMO detector supporting up to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cda2440d23fcbb9ebea6500999a0dc1
https://doi.org/10.1007/s11265-015-1093-2
https://doi.org/10.1007/s11265-015-1093-2
Autor:
Sudhakar Yalamanchili, Owen Sullivan, Borislav Alexandrov, William J. Song, Satish Kumar, Saibal Mukhopadhyay
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 22:1909-1919
Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreade
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f66218c97b6d6a68d8bc229a98e76502
https://doi.org/10.1109/tvlsi.2013.2278951
https://doi.org/10.1109/tvlsi.2013.2278951
Autor:
Elias Szabo-Wexler, Anthony L. Chun, Dongmin Yoon, Borislav Alexandrov, Farhana Sheikh, Wei Wang, Mehnaz Rahman, Hossein Alavi
Publikováno v:
SiPS
Lattice reduction (LR) aided detectors mitigate the exponentially increasing complexity of large multiple-input, multiple-output (MIMO) systems while achieving near-optimal performance with low computational complexity. In this paper, a channel-adapt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8e764aabd9c98efcfb5ecbb8ab96cb29
https://zenodo.org/record/1280174
https://zenodo.org/record/1280174
Publikováno v:
ISLPED
This paper presents an on-chip thermoelectric (TE) energy management system for energy-efficient on-demand active cooling of integrated circuits. Embedding a TE module (TEM) within the package has shown potential for on-demand cooling of integrated c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f1e47f8ffc45c981327a5ffdfcd4173
https://doi.org/10.1145/2627369.2627634
https://doi.org/10.1145/2627369.2627634
Publikováno v:
Journal of Electronic Packaging. 135
Hotspots on a microelectronic package can severely hurt the performance and long-term reliability of the chip. Thermoelectric coolers (TECs) can provide site-specific and on-demand cooling of hot spots in microprocessors. We develop a 3D compact mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2b119e438dffd6137ff5b861dd23db8
https://doi.org/10.1115/1.4024653
https://doi.org/10.1115/1.4024653
Publikováno v:
ASP-DAC
Super-lattice thin-film thermoelectric coolers (TEC) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreade
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cbb7a2604c07c2852ae5cf2161232d8
https://doi.org/10.1109/aspdac.2012.6165033
https://doi.org/10.1109/aspdac.2012.6165033
Publikováno v:
Volume 10: Heat and Mass Transport Processes, Parts A and B.
Hot spots on a microelectronic package can severely hurt the performance and long-term reliability of the chip. Thermoelectric coolers (TECs) have been shown to potentially provide efficient site-specific on-demand cooling of hot spots in microproces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3927e5eb20162325e8ac63a3294392d3
https://doi.org/10.1115/imece2011-64881
https://doi.org/10.1115/imece2011-64881