Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Boris Vasilev"'
Autor:
Desislava Kostova-Lefterova, Mariela Vasileva-Slaveva, Svilen Maslyankov, Assia Konsoulova, Margarita Atanasova, Tsvetelina Paycheva, Alexandrina Vlahova, Marusya Genadieva-Yordanova, Ginka Prodanova, Zahari Zahariev, Vasil Pavlov, Georgi Todorov, Boris Vasilev, Kostadin Angelov, Tashko Deliyski, Ivelina Petrova, Desislava Hitova, Ivo Petrov
Publikováno v:
Current Oncology, Vol 28, Iss 5, Pp 3932-3944 (2021)
(1) Background: We aimed to analyze currently available studies with intraoperative radiotherapy (IORT) as a choice of treatment where the Xoft Axxent® electronic brachytherapy (eBx) system was used as a single-dose irradiation and an exclusive radi
Externí odkaz:
https://doaj.org/article/de42e7803a764ac9985d15998c88ba45
Autor:
Ushasree Katakamsetty, Stefan Nikolaev Voykov, Boris Vasilev, Sam Nakagawa, Tamba Tugbawa, Jansen Chee, Aaron Gower-Hall, Brian Lee, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Autor:
Ivo Petrov, Boris Vasilev, Tashko S. Deliyski, Ivelina U. Petrova, Assia Konsoulova, Ginka Prodanova, Mariela Vasileva-Slaveva, Marusya Genadieva-Yordanova, Alexandrina Vlahova, Angelov K, Vasil Pavlov, Georgi Todorov, Tsvetelina Paycheva, Desislava Hitova, Svilen Maslyankov, Margarita Atanasova, Desislava Kostova-Lefterova, Zahari Zahariev
Publikováno v:
Current Oncology, Vol 28, Iss 335, Pp 3932-3944 (2021)
Current Oncology
Current Oncology
(1) Background: We aimed to analyze currently available studies with intraoperative radiotherapy (IORT) as a choice of treatment where the Xoft Axxent® electronic brachytherapy (eBx) system was used as a single-dose irradiation and an exclusive radi
Publikováno v:
Journal of Dynamics and Vibroacoustics. 4:27-36
This work is of a survey nature based on the results of studies of the processes of sound emission in gases and liquids by thermo-acoustic film sources - thermophones. The purpose of the article is to show the features of the calculation, operation a
Autor:
Panos Paparrigopoulos, Julia Andreeva, Boris Vasilev, Alexey Anisenkov, Alessandro Di Girolamo
Publikováno v:
EPJ Web of Conferences, Vol 245, p 03032 (2020)
CRIC is a high-level information system which provides flexible, reliable and complete topology and configuration description for a large scale distributed heterogeneous computing infrastructure. CRIC aims to facilitate distributed computing operatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6703c31477e085b74eb42af60b97b4ea
Publikováno v:
Microelectronic Engineering. 91:159-166
Chemical mechanical planarization (CMP) models which are able to make predictions on the chip and feature scale are highly desirable in semiconductor manufacturing. Most of the models proposed in the past years have largely focused on the pattern den
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 24:338-347
Chemical mechanical planarization (CMP) models which are able to make predictions for a full chip are highly desirable in semiconductor manufacturing. Previous models proposed to this end have largely focused on effects of pattern density. We here ex
Chemical-mechanical planarization (CMP) is one of the most demanding process steps in interconnect integration. Therefore, with respect to the pad roughness, we systematically characterize and model the planarization of special CMP test chips, which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::45288c606ed72caee9f033e806e899e3
https://publica.fraunhofer.de/handle/publica/232255
https://publica.fraunhofer.de/handle/publica/232255
Chemical-mechanical planarization (CMP) is one of the most demanding process steps in interconnect integration, because it is influenced by numerous variables. Among them is the roughness of the polishing pad. Therefore we systematically characterize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::122d4c1780d56e33a1a04108cbc29579
https://publica.fraunhofer.de/handle/publica/233346
https://publica.fraunhofer.de/handle/publica/233346
Publikováno v:
2011 IEEE International Interconnect Technology Conference.
Chemical-mechanical planarization (CMP) is one of the most demanding process steps in interconnect integration. Therefore we systematically investigate the planarization of adjacent line-space structures, which emulate IC layouts, as a function of th