Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Boris Bouillard"'
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Zero defect in semiconductor packaging is key especially for high demanding reliability applications (automotive, spatial…) combined with high performance technologies (Silicon ultra lowK wafers 40nm and beyond). The most complex challenge is the C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5037cb0b92a71bab7b20cc74a9685cb
https://doi.org/10.1109/estc48849.2020.9229792
https://doi.org/10.1109/estc48849.2020.9229792
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
For all applications where a semiconductor device is used, there is a demand for improved performance under all environmental conditions. One such application, which is in regular use, is the smartcard chip that is found predominantly in bank or trav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6d9a67a8ff3bb85d439793f7a802a51
https://doi.org/10.1109/ectc.2019.00072
https://doi.org/10.1109/ectc.2019.00072
Autor:
Adrien Gasse, Aurelie Vandeneynde, Frederic Mercier, N. Ait-Mani, Bertrand Chambion, Pamela Rueda, A. Gueugnot, David Henry, Boris Bouillard
Publikováno v:
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
This work deals with an overall concept of a 3D-stack enabling to produce a directly pluggable high voltage power LED. Using a dedicated silicon vehicle test, a thermal study is carried out with an extensive thermal modelling, optimization, assembly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0476e99931187f8a091a9c431e79d47c
https://doi.org/10.1109/therminic.2017.8233843
https://doi.org/10.1109/therminic.2017.8233843
Autor:
Aurelie Vandeneynde, Vincent Beix, Frederic Mercier, Abdenacer Ait Mani, Bertrand Chambion, Pamela Rueda, Marion Volpert, Adrien Gasse, Thomas Lacave, Boris Bouillard, David Henry, Brigitte Soulier
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
For the need of energy saving, LEDs are taking more and more space in lighting modules. Moreover, LEDs add several applications to the lighting function, smartness, dimming, bio photonic applications, a lot of fields that none former light sources co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09dfe8ae6febcaffe63d29bc33a7a691
https://doi.org/10.23919/empc.2017.8346883
https://doi.org/10.23919/empc.2017.8346883
Autor:
David Henry, Yannick Goiran, Sylvie Jarjayes, T. Chaira, Gilles Lasfargues, Bertrand Chambion, Aureili Vandeneynde, Marion Volpert, Divya Taneja, Fiqiri Hodaj, Boris Bouillard
Publikováno v:
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, 345 E 47TH ST, NEW YORK, NY 10017 USA, Unknown Region. pp.376-383, ⟨10.1109/ECTC.2017.154⟩
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, 345 E 47TH ST, NEW YORK, NY 10017 USA, Unknown Region. pp.376-383, ⟨10.1109/ECTC.2017.154⟩
IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, MAY 30-JUN 02, 2017; International audience; Several types of interconnects for the finer pitch assembly are currently being investigated across the globe. Here i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e387657075c30e33be789cd99d6ac56
https://hal.science/hal-01914024
https://hal.science/hal-01914024
