Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Boo Taek Lim"'
Autor:
Sung-Soon Choi, Boo Taek Lim, Kisu Joo, Boung Ju Lee, Euijoon Yoon, Tae-Ryong Kim, Se Young Jeong, Myung Jin Yim
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this study, an alumina coated silver core/shell structure particles were prepared through a solgel approach. Various techniques were used to characterize the as-prepared products, including field emission scanning electron microscopy (FE-SEM), fie
Autor:
Sung-Soon Choi, Kisu Joo, Boo Taek Lim, Tae-Ryong Kim, Se Young Jeong, Euijoon Yoon, Myung Jin Yim, Boung Ju Lee
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this study, we investigated the correlation between thermal conductivity and insulative shell thickness of SiO2 coated Ag (SCA) particles for the thermal filler material in the high performance underfill with focus on improved thermal conductivity
Autor:
Hi Deok Lee, Boo Taek Lim, Gyung Tae Kim, Young-Su Kim, Seong Kyu Lim, Tae Hyun Kim, Ga-Won Lee
Publikováno v:
IEEE Photonics Technology Letters. 25:2108-2110
In this letter, a meshed leg structure is proposed for the first time to control the thermal conductivity in the uncooled microbolometer arrays without changing the fill factor. An amorphous silicon-based microbolometer was fabricated with 64 × 64 a
Publikováno v:
Frontiers in Optics 2009/Laser Science XXV/Fall 2009 OSA Optics & Photonics Technical Digest.
An ultra small temperature sensor was proposed and implemented utilizing a silicon ring resonator with a 4-?m ring radius. The observed sensitivity was ~85 pm/ o C over the 38 o C range around the room temperature.