Reliability evaluation of GaAs MMICs

Autor: Lindsay, C.E., Bolbot, P.H., Buckle, C., Drummond, E.I., Conlon, R.F.B.

Publikováno v: Lindsay, C.E. ; Bolbot, P.H. ; Buckle, C. ; Drummond, E.I. ; Conlon, R.F.B. (1992) Reliability evaluation of GaAs MMICs. In: Gallium Arsenide Applications Symposium. GAAS 1992, 27-29 April 1992, Noordwijk, The Netherlands.

GaAs MMICs offer significant advantages for space applications. As the technology reaches maturity and as applications are being identified, GMMT together with ESA have embarked upon the first stage of space qualification of the GMMT GaAs foundry. Th

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bbcd406203e5e25a1bf0378733e5c55b

A Comparison of Trench Filling Materials for Sub-Micron CMOS.

Autor: Bolbot, P.H., Roberts, M.C., Medhurst, P.L.

Publikováno v: ESSDERC '88: 18th European Solid State Device Research Conference; 1988, pc4-c540, 1071p

Optimization of oxygen-implanted silicon substrates for CMOS devices by electrical characterization.

Autor: Foster, D.J., Butler, A.L., Bolbot, P.H., Alderman, J.C.

Publikováno v: IEEE Transactions on Electron Devices; 1986, Vol. 33 Issue 3, p354-360, 7p

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