Auger depth profiles of TiN/Ti films in submicron contact holes: A comparison of collimated and uncollimated deposition processes.

Autor: Hoener, Carolyn F., Pylant, Eddie, Boden, Edward G., Wang, Shi-Qing

Publikováno v: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1994, Vol. 12 Issue 3, p1394-1401, 8p