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Autor:
Ryan Scott Smith, Shan Gao, SeokHo Na, MyeongJin Kim, Eng Chye Chua, Seungman Choi, Bob Shih-Wei Kuo, YunHee Kim, Jae Kyu Cho, Miguel Jimarez, JinSuk Jeong, JaeWook Shin, Sukeshwar Kannan
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
The need for high performance and multi-functional devices drove silicon manufacturers to introduce ultra-low dielectric constant (ULK) materials into the back-end-of-line (BEOL) of silicon manufacturing. This innovative technology resulted in perfor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73b0d9f554c0c643cb23684591d973f0
https://doi.org/10.1109/ectc.2015.7159564
https://doi.org/10.1109/ectc.2015.7159564
