Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Bob Pack"'
Autor:
Frank E. Gennari, Karthik Krishnamoorthy, Shikha Somani, Ya-Chieh Lai, Sriram Madhavan, Piyush Pathak, Fadi Batarseh, Wei-Long Wang, Uwe Paul Schroeder, Philippe Hurat, Jason Sweis, Bob Pack, Jaime Bravo
Publikováno v:
SPIE Proceedings.
At advanced technology nodes (sub-22 nm), design rules become very complicated as interactions between multiple layers become more complex, while the number of design elements within the optical radius increases. As a result, one may possibly encount
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e9c57b98fcbe9ee58eddeac4880d907
https://doi.org/10.1117/12.2220145
https://doi.org/10.1117/12.2220145
Autor:
Byung-Gook Kim, Chan-Uk Jeon, Jisoong Park, Sterling Watson, Bob Pack, Ingo Bork, Jin Choi, Anthony Adamov
Publikováno v:
SPIE Proceedings.
Model-Based Mask Data Preparation (MB-MDP) has been discussed in the literature for its benefits in reducing mask write times [1][2]. By being model based (i.e., simulation based), overlapping shots, per-shot dose modulation, and circular and other c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b96c7ea7541f051194195f08fb04e1a4
https://doi.org/10.1117/12.966327
https://doi.org/10.1117/12.966327
Autor:
Kyung-Youl Min, John Garcia, Christophe Suzor, Victor V. Boksha, Mitch Heins, Rafik Marutyan, Anthony Adamov, John Gookassian, Sergei Bakarian, Gurgen Lachinyan, Hitendra Divecha, Bob Pack, Dean Frazier, Brian Gordon, Dan White, Brian Dillon
Publikováno v:
Design and Process Integration for Microelectronic Manufacturing III.
There is a growing realization of the need for highly integrated solutions enabled by new bi-directional data 'pipes' between design and manufacturing. Traditional EDA applications should be able to communicate and collaborate with yield analysis sof
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2feb8b6b5ef1bbbf5f1bd206a9b821e6
https://doi.org/10.1117/12.600261
https://doi.org/10.1117/12.600261