Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Boaz Weinfeld"'
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
This paper describes a unique method of encapsulating MEMS switches at the wafer level using a thin-film “microshell” lid and a novel micro-embossing, or “stamping” technique to seal the lid. After fabrication of the MEMS switch and subsequen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::394b55ff7ac1234a6f020962e95b4541
https://doi.org/10.1115/ipack2007-33887
https://doi.org/10.1115/ipack2007-33887
Autor:
Li-Peng Wang, Qing Ma, Ming Yuan He, Friedel Gerfers, Boaz Weinfeld, Dean A. Samara-Rubio, Valluri R. Rao, Eyal Ginsburg
Publikováno v:
2006 5th IEEE Conference on Sensors.
Piezoelectric films have been demonstrated to be attractive for micromechanical systems (MEMS) devices. Among the piezoelectric films used, AlN film has been less explored. In this study, AlN resonators and accelerometers, utilizing longitudinal and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::243300fac30d41775fd412fa1253a698
https://doi.org/10.1109/icsens.2007.355705
https://doi.org/10.1109/icsens.2007.355705