Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Boaz Kenan"'
Autor:
Mike Bohan, M. Duane, Paul C. Allen, Peter Pirogovsky, Eric R. Christenson, Malik K. Sadiq, Sam C. Howells, Boaz Kenan, Michael White, Robin Teitzel, H. Dai, Henry Chris Hamaker
Publikováno v:
SPIE Proceedings.
The capability and performance of the production-proven DUV ALTA 4300 system has been extended by the development of two new optical subsystems: a 0.9 NA, 42X reduction lens and a high-bandwidth acousto-optic deflector based beam position and intensi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06ca1a304ad2952e100a66a6f85bcc76
https://doi.org/10.1117/12.637280
https://doi.org/10.1117/12.637280
Autor:
H. Christopher Hamaker, Robert Kiefer, Michael E. Ungureit, Boaz Kenan, Alan J. Wickstrom, Sam C. Howells, Michael Bohan, Curt Jackson, Eric R. Christenson, Malik K. Sadiq, Peter Pirogovsky, Paul C. Allen, Robin Teitzel, Michael White
Publikováno v:
SPIE Proceedings.
The capability of the DUV ALTAO 4300 system has been extended by the development of two new optical subsystems: a 0.9 NA, 42X reduction lens and a high-bandwidth acousto-optic deflector based beam position and intensity correction servo. The PSM over
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5091775115dc2dd91594577b4fbe8093
https://doi.org/10.1117/12.570291
https://doi.org/10.1117/12.570291
Autor:
Peter Pirogovsky, Asher Klatchko, Boaz Kenan, Paul C. Allen, Alex Buxbaum, Samuel C. Howells, Michael White, Robin Teitzel
Publikováno v:
SPIE Proceedings.
The ALTA 4300 system has been used to successfully write many advanced design layers previously only feasible with 50kV vector shaped beam tools. In order to further enlarge the application space of this high productivity an aerial image enhancement
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d226d4b47f1da61e3ba2db6dc11499c
https://doi.org/10.1117/12.518218
https://doi.org/10.1117/12.518218
Publikováno v:
SPIE Proceedings.
The paper presents a new technology to inspect alternating phase shifting masks. Instead of finding defects based on a size-dependent defect specification, defects are found according to their impact at the wafer CD result. The inspection methodology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db924b7749b945659b9ab5099ccfbc89
https://doi.org/10.1117/12.467781
https://doi.org/10.1117/12.467781