Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Bo-Sheng Lee"'
Autor:
Po-Wei Chen, Po-Wen Hsiao, Hsuan-Jen Chen, Bo-Sheng Lee, Kai-Ping Chang, Chao-Chun Yen, Ray-Hua Horng, Dong-Sing Wuu
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
Abstract The mechanism of carrier recombination in downsized μ-LED chips from 100 × 100 to 10 × 10 μm2 on emission performance was systemically investigated. All photolithography processes for defining the μ-LED pattern were achieved by using a
Externí odkaz:
https://doaj.org/article/ca59de586c984864bf45bd195eede79b
Autor:
Dong-Sing Wuu, Hsuan-Jen Chen, Po-Wen Hsiao, Kai Ping Chang, Chao-Chun Yen, Bo-Sheng Lee, Po-Wei Chen, Ray-Hua Horng
Publikováno v:
Scientific Reports
Scientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
Scientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
The mechanism of carrier recombination in downsized μ-LED chips from 100 × 100 to 10 × 10 μm2 on emission performance was systemically investigated. All photolithography processes for defining the μ-LED pattern were achieved by using a laser dir
Autor:
Jo Shu Chang, Chien An Su, Pau Loke Show, John Chi-Wei Lan, Chung Lim Law, Hui Yi Leong, Bo Sheng Lee
Publikováno v:
Bioresource Technology. 271:30-36
Microalgae biorefinery is presently receiving a lot of attention as driven by its production of high value-added products. In this study, an oleaginous microalga Aurantiochytrium limacinum SR21 was cultured for docosahexaenoic acid (DHA) production u
Publikováno v:
Microelectronics Reliability. 55:2336-2344
A numerical procedure for constructing the multiaxial viscoelastic model for polymeric packaging material over a wide range of temperature is presented. By using the proposed best-fitting procedure, experimentally measured frequency-domain Young's an
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A procedure for constructing the three-dimensional viscoelastic constitutive model of polymeric packaging material over a wide range of temperatures is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mecha