Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Bo-Rong Huang"'
Autor:
Chia-Hung Lee, Erh-Ju Lin, Jyun-Yang Wang, Yi-Xuan Lin, Chen-Yu Wu, Chung-Yu Chiu, Ching-Yu Yeh, Bo-Rong Huang, Kuan-Lin Fu, Cheng-Yi Liu
Publikováno v:
Nanomaterials, Vol 11, Iss 7, p 1630 (2021)
Tensile tests were carried on the electroplated Cu films with various densities of twin grain boundary. With TEM images and a selected area diffraction pattern, nano-twinned structure can be observed and defined in the electroplated Cu films. The den
Externí odkaz:
https://doaj.org/article/890066b2ded346778f4a399fb5dd9352
Autor:
Bo-Rong Huang, 黃柏融
103
This study adopted the architecture of spectral amplitude coding optical code division multiple access and polarization division multiplexing to capture the electric signal frequencies inputted into anelectrooptic modulator (EOM). The encode
This study adopted the architecture of spectral amplitude coding optical code division multiple access and polarization division multiplexing to capture the electric signal frequencies inputted into anelectrooptic modulator (EOM). The encode
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/mhmsqw
Autor:
Bo-rong Huang, 黃柏榮
102
In this research, we successfully prepared the mesoporous silica spheres by sol-gel method. We have used the potassium hexacyanoferrate (K3Fe(CN)6) as etching agent to get mesoporous hollow SiO2 spheres. In addition, the TiO2 nanoparticles w
In this research, we successfully prepared the mesoporous silica spheres by sol-gel method. We have used the potassium hexacyanoferrate (K3Fe(CN)6) as etching agent to get mesoporous hollow SiO2 spheres. In addition, the TiO2 nanoparticles w
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/57281212976532741958
Autor:
Bo-rong Huang, 黃柏融
101
Diffusion tensor imaging (DTI) is a technology which is used in the study and treatment of neurological disorders. Further fiber networks can be detected using tractography. In the present, algorithms of tractography can be separated into tw
Diffusion tensor imaging (DTI) is a technology which is used in the study and treatment of neurological disorders. Further fiber networks can be detected using tractography. In the present, algorithms of tractography can be separated into tw
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/29445567850817018840
Autor:
Bo-Rong Huang, 黃柏榮
99
High peak-to-average power ratio (PAPR) is a serious drawback in orthogonal frequency division multiplexing (OFDM) systems. Various methods have been proposed to reduce PAPR, active constellation extension (ACE) scheme has excellent performan
High peak-to-average power ratio (PAPR) is a serious drawback in orthogonal frequency division multiplexing (OFDM) systems. Various methods have been proposed to reduce PAPR, active constellation extension (ACE) scheme has excellent performan
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/62817360846554098214
Autor:
Bo-Rong Huang, 黃柏融
98
Cu6Sn5 is the most common intermetallic compound (IMC) at the interface of Pb-free solder joints. Considering that IMC plays a crucial role for the joint reliability, this study investigated the orientational and metallurgical dependences on
Cu6Sn5 is the most common intermetallic compound (IMC) at the interface of Pb-free solder joints. Considering that IMC plays a crucial role for the joint reliability, this study investigated the orientational and metallurgical dependences on
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/98682212568805902559
Autor:
Chia Hung Lee, J. S. Chang, Y. X. Lin, C. Y. Wu, J. Y. Wang, C. Y. Chen, T. H. Yen, Chung Yu Chiu, Ching Yu Yeh, Cheng Yi Liu, Bo Rong Huang, Kuan Lin Fu
Publikováno v:
Journal of Electronic Materials. 50:6584-6589
The present work investigated the effect of Ag additives on the consumption of cathode Cu pad under electromigration in a current-stressed Cu/Sn3.5Ag/Cu flip-chip structure. The consumption rate of a cathode Cu pad in a pure Sn system is faster than
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bad0bda752755a0c811dc6f148047f0
https://doi.org/10.1007/s11664-021-09234-7
https://doi.org/10.1007/s11664-021-09234-7
Autor:
C. Y. Wu, Cheng Yi Liu, Bo Rong Huang, Kuan Lin Fu, Chia Hung Lee, Y. X. Lin, Ching Yu Yeh, J. S. Chang, Chung Yu Chiu, J. Y. Wang
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:18605-18615
Typically, Sn cannot be finished on Ni and Ag surfaces via the immersion process. In this work, through galvanic reaction, immersion Sn finish was processed on an immersion Ag finish coexisting with a Ni surface. Herein, the detailed mechanism of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0df18f1cbf88d540d62aeabb3e9b5579
https://doi.org/10.1007/s10854-021-06306-6
https://doi.org/10.1007/s10854-021-06306-6
Autor:
Chia Hung Lee, C. Y. Wu, Y. X. Lin, Chung Yu Chiu, J. Y. Wang, Cheng Yi Liu, Bo Rong Huang, Ching Yu Yeh
Publikováno v:
Journal of the American Ceramic Society. 104:1707-1715
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74e5596b04597ab947bb95348ccea966
https://doi.org/10.1111/jace.17586
https://doi.org/10.1111/jace.17586
Autor:
Chia Yueh Chou, Wei Hao Chen, Ching Yu Yeh, Mao Feng Hsu, Bao Jhen Li, Cheng Yi Liu, Bo Rong Huang, Sheng Feng Chung
Publikováno v:
Journal of Electronic Materials. 50:779-785
The conductive and transparent properties of ZnO/Cu/ZnO sandwich structures were investigated in this study. The I–V curves of single ZnO films with different thicknesses were recorded and plotted. The linear I–V curves confirmed the ohmic conduc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b2801261a477f2c846d615508d6e2b3
https://doi.org/10.1007/s11664-020-08471-6
https://doi.org/10.1007/s11664-020-08471-6