Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Bo-Mook Chung"'
Publikováno v:
Journal of Alloys and Compounds. 579:75-81
We examined the effects of layers of intermetallic compound (IMC) Ni 3 Sn 4 and (Cu,Ni) 6 Sn 5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couple
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e08bb4be2a0edd6bdc6769f945dff81e
https://doi.org/10.1016/j.jallcom.2013.05.055
https://doi.org/10.1016/j.jallcom.2013.05.055
Publikováno v:
Electrochimica Acta. 106:333-341
a b s t r a c t In order to gain further insight into the formation mechanism of fire-through Ag contacts of Si solar cells, the ionization of Ag during the dissolution of Ag powder into a lead borosilicate glass melt was electrochemically investigat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba1a591f68dd2fac99c49c25f0d236a7
https://doi.org/10.1016/j.electacta.2013.05.109
https://doi.org/10.1016/j.electacta.2013.05.109
Publikováno v:
Journal of Electronic Materials. 41:3348-3358
The microstructural evolution between Sn-3Ag-0.5Cu (SAC305) solder and Ni(P)/Pd(P)/Au finish during the reflow process was investigated for various Pd(P) thicknesses (0 μm to 0.6 μm). The reflow process was carried out in a belt-conveying reflow ov
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c3b22c9caa400d30733fea95ac35471
https://doi.org/10.1007/s11664-012-2320-2
https://doi.org/10.1007/s11664-012-2320-2
Publikováno v:
Journal of Electronic Materials. 41:44-52
To simulate the growth of Ni3Sn4 phase layers in Sn-based solder joints with Ni substrates during solid-state aging, Sn/(Cu1−x Ni x )6Sn5/Ni and Sn/Ni diffusion couples were aged isothermally at 180°C and 200°C, and the growth kinetics of the (Ni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62588bb10430e1df084ed8198bf16848
https://doi.org/10.1007/s11664-011-1736-4
https://doi.org/10.1007/s11664-011-1736-4
Publikováno v:
Korean Journal of Metals and Materials. 48:1041-1046
The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, 0.4 μm) were examined for the effect of the Pd layer on the massive sp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed16ed0b2d93e7897a43b32981f53474
https://doi.org/10.3365/kjmm.2010.48.11.1041
https://doi.org/10.3365/kjmm.2010.48.11.1041
Publikováno v:
Metals and Materials International. 15:487-492
The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3931fc97d0bcde901042608d12d8916
https://doi.org/10.1007/s12540-009-0487-8
https://doi.org/10.1007/s12540-009-0487-8
Publikováno v:
2009 34th IEEE Photovoltaic Specialists Conference (PVSC); 2009, p000766-000769, 4p