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Autor:
Simone Capecchi, Frank Kuechenmeister, Bjoem Boehme, Christian Goetze, Ta-Chien Cheng, Dirk Breuer, Maricel Sy
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
This paper summarizes the work which was done to understand the die warpage at different temperatures and the influence on the assembly yield in a FCCSP package in combination with Cu pillar first level interconnects. A Cu BEoL stack with two ultra-t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::610c2be5be438e265f41c66f05abe1a3
https://doi.org/10.23919/empc44848.2019.8951758
https://doi.org/10.23919/empc44848.2019.8951758
