Zobrazeno 1 - 10
of 60
pro vyhledávání: '"Bismarck Luiz Silva"'
Autor:
Jeverton Laureano Paixão, Raí Batista de Sousa, Pâmella Raffaela Dantas de Freitas, Rubiamara Mauricio de Sousa, Jefferson Romáryo Duarte da Luz, Bismarck Luiz Silva, José Eduardo Spinelli
Publikováno v:
ACS Omega, Vol 9, Iss 8, Pp 8829-8845 (2024)
Externí odkaz:
https://doaj.org/article/53fc3dbfc20642ee803e49e31643da17
Autor:
Leonardo Fernandes Gomes, Bismarck Luiz Silva, Paulo Sérgio da Silva Jr, Amauri Garcia, José Eduardo Spinelli
Publikováno v:
Materials Research Express, Vol 8, Iss 1, p 016527 (2021)
The development of new light and efficient systems in electric vehicles (EV) opens up new research opportunities. One of these fronts involves the development of alternative Al-Si alloys. With the current demands for increased EV autonomy, alloys tha
Externí odkaz:
https://doaj.org/article/2d057736244a426fa1c9f4e488926036
Autor:
Clarissa Barros da Cruz, Rafael Kakitani, Marcella Gautê Cavalcante Xavierb, Bismarck Luiz Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli
Publikováno v:
Materials Research, Vol 21, Iss suppl 1 (2018)
The present research work examines the microstructural arrangements formed during the transient solidification of eutectic Sn-0.2wt.%Ni and hypereutectic Sn-0.5wt.%Ni alloys. Also, it examines their respective correlations with solidification thermal
Externí odkaz:
https://doaj.org/article/eebcee193e3a44a5b96e57d0be2c196c
Publikováno v:
Materials Research, Vol 21, Iss 2 (2018)
The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were perfo
Externí odkaz:
https://doaj.org/article/5c5a3bad06444c2bb31043ecb82cad90
Publikováno v:
Materials Research, Vol 17, Iss 3, Pp 767-774 (2014)
Al-Fe hypoeutectic alloys are a family of casting alloys characterized by cell growth, low cost and appreciable formability. It is well known that fatigue strength is a requirement of prime importance considering the nature of load typically observed
Externí odkaz:
https://doaj.org/article/07c943d60def41189ed3c34b5f32fb40
Autor:
Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, José Eduardo Spinelli, Noé Cheung
Publikováno v:
Metals, Vol 9, Iss 2, p 241 (2019)
In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests cou
Externí odkaz:
https://doaj.org/article/420884667ccc4e68be16b7e1e5208b3e
Publikováno v:
Journal of Electronic Materials. 51:4640-4648
Autor:
Aline Ferreira Schon, Guilherme Lisboa de Gouveia, Bruno Silva Sobral, José Eduardo Spinelli, Rudimar Riva, Aline Gonçalves Capella, Bismarck Luiz Silva
Publikováno v:
Journal of Alloys and Compounds. 954:170189
Autor:
Noé Cheung, Rafael Kakitani, Bismarck Luiz Silva, Cássio A.P. Silva, José E. Spinelli, Amauri Garcia
Publikováno v:
Soldering & Surface Mount Technology. 34:24-30
Purpose Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients w
Autor:
Noé Cheung, Amauri Garcia, José E. Spinelli, Bismarck Luiz Silva, Rudimylla Septimio, Clarissa Cruz
Publikováno v:
Journal of Applied Electrochemistry. 51:769-780
In electronic devices the solder joint is exposed not only to the air but also to moistures and other corrosive media such as chlorine and sulfur compounds. Bi–Ag alloys meet the melting temperature requirement to be classified as high-temperature