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Autor:
John Owen Dukovic, Ravindra Vaman Shenoy, Christopher V. Jahnes, P. C. Andricacos, Hariklia Deligianni, H.M. Tong, Madhav Datta, H Nye, Lubomyr T. Romankiw, Birenda Nath Agarwala, Jeffrey Frederick Roeder, J. Horkans, P. Totta
Publikováno v:
Journal of The Electrochemical Society. 142:3779-3785
Electrochemical fabrication of PbSn C4s (controlled collapse chip connection) offers significant cost, reliability, and environmental advantages over the currently employed evaporation technology. A continuous seed layer is required for through-mask