Zobrazeno 1 - 10
of 11 864
pro vyhledávání: '"Bionics"'
Autor:
Zhang W; Key Laboratory of Advanced Processing Technology and Intelligent Manufacturing (Heilongjiang Province), Harbin University of Science and Technology, Harbin 150080, China.; Postdoctoral Research Center of Instrument Science and Technology, Harbin University of Science and Technology, Harbin 150080, China., Yu J; Key Laboratory of Advanced Processing Technology and Intelligent Manufacturing (Heilongjiang Province), Harbin University of Science and Technology, Harbin 150080, China., Yu X; Postdoctoral Research Center of Instrument Science and Technology, Harbin University of Science and Technology, Harbin 150080, China., Zhang Y; Key Laboratory of Advanced Processing Technology and Intelligent Manufacturing (Heilongjiang Province), Harbin University of Science and Technology, Harbin 150080, China., Men Z; Key Laboratory of Advanced Processing Technology and Intelligent Manufacturing (Heilongjiang Province), Harbin University of Science and Technology, Harbin 150080, China.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2024 Oct 03; Vol. 24 (19). Date of Electronic Publication: 2024 Oct 03.
Autor:
Ganesh Kumar N; From the Section of Plastic Surgery, Department of Surgery., Chestek CA; Department of Biomedical Engineering and Computer Science, University of Michigan., Cederna PS; From the Section of Plastic Surgery, Department of Surgery., Kung TA; From the Section of Plastic Surgery, Department of Surgery.
Publikováno v:
Plastic and reconstructive surgery [Plast Reconstr Surg] 2024 Oct 01; Vol. 154 (4), pp. 713e-724e. Date of Electronic Publication: 2023 Nov 06.
Autor:
Xu J; State Key Laboratory of Robotics and System, School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, China., Xu B; Light Industry College, Harbin University of Commerce, Harbin, 150028, China., Yue H; State Key Laboratory of Robotics and System, School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, China., Xie Z; College of mechanical and electrical engineering, Northeast Forestry University, Harbin, 150042, China., Tian Y; Light Industry College, Harbin University of Commerce, Harbin, 150028, China., Yang F; State Key Laboratory of Robotics and System, School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, China.
Publikováno v:
Advanced healthcare materials [Adv Healthc Mater] 2024 Sep; Vol. 13 (22), pp. e2302761. Date of Electronic Publication: 2024 Jun 20.
Autor:
NOVAK, SARA (AUTHOR)
Publikováno v:
Discover. Jul/Aug2024, Vol. 45 Issue 4, p40-45. 6p. 9 Color Photographs.
Autor:
Ye L; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, People's Republic of China., Xu L; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, People's Republic of China.; Changzhou Key Laboratory of Intelligent Manufacturing Technology and Equipment, Changzhou, People's Republic of China.; Suzhou Research Institute, Hohai University, Suzhou, People's Republic of China., Wang Z; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, People's Republic of China., Wang L; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, People's Republic of China., Mei H; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, People's Republic of China., Wu T; Wuhan Second Ship Design & Research Institute, Wuhan 430205, People's Republic of China.
Publikováno v:
Bioinspiration & biomimetics [Bioinspir Biomim] 2024 Aug 30; Vol. 19 (5). Date of Electronic Publication: 2024 Aug 30.
Autor:
Guo B; School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China. gang.liu@sjtu.edu.cn., Zhong X; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Yu Z; School of Materials, Sun Yat-Sen University, Guangzhou, Guangdong 510275, China., He Z; School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China. gang.liu@sjtu.edu.cn., Liu S; School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China. gang.liu@sjtu.edu.cn., Wu Z; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Liu S; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Guo Y; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Chen W; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Duan H; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Zeng J; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China., Gao P; School of Materials, Sun Yat-Sen University, Guangzhou, Guangdong 510275, China., Zhang B; School of Chemistry and Molecular Engineering, East China University of Science and Technology, Shanghai 200237, China., Chen Q; School of Chemistry and Molecular Engineering, East China University of Science and Technology, Shanghai 200237, China.; Minhang Hospital, Fudan University, Shanghai 201199, China., He H; Minhang Hospital, Fudan University, Shanghai 201199, China., Chen Y; School of Chemistry and Molecular Engineering, East China University of Science and Technology, Shanghai 200237, China., Liu G; School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China. gang.liu@sjtu.edu.cn.; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Publikováno v:
Materials horizons [Mater Horiz] 2024 Aug 28; Vol. 11 (17), pp. 4075-4085. Date of Electronic Publication: 2024 Aug 28.
Autor:
Georgopoulou A; High Performance Ceramics Laboratory, Empa, Swiss Federal Laboratories for Material Science and Technology, Dübendorf, 8600, Switzerland., Filippi M; Soft Robotics Laboratory, Department of Mechanical and Process Engineering, ETH Zurich, Zurich, 8092, Switzerland., Stefani L; Soft Robotics Laboratory, Department of Mechanical and Process Engineering, ETH Zurich, Zurich, 8092, Switzerland.; Department of Biomedicine, University Hospital Basel, University of Basel, Basel, 4031, Switzerland., Drescher F; Soft Robotics Laboratory, Department of Mechanical and Process Engineering, ETH Zurich, Zurich, 8092, Switzerland., Balciunaite A; Soft Robotics Laboratory, Department of Mechanical and Process Engineering, ETH Zurich, Zurich, 8092, Switzerland., Scherberich A; Department of Biomedicine, University Hospital Basel, University of Basel, Basel, 4031, Switzerland., Katzschmann R; Soft Robotics Laboratory, Department of Mechanical and Process Engineering, ETH Zurich, Zurich, 8092, Switzerland., Clemens F; High Performance Ceramics Laboratory, Empa, Swiss Federal Laboratories for Material Science and Technology, Dübendorf, 8600, Switzerland.
Publikováno v:
Advanced healthcare materials [Adv Healthc Mater] 2024 Aug; Vol. 13 (20), pp. e2400051. Date of Electronic Publication: 2024 May 03.
Autor:
Ortiz-Catalan M; The Bionics Institute, Melbourne, Victoria, Australia. maxortizc@outlook.com.; Department of Bionic Medicine, University of Melbourne, Melbourne, Victoria, Australia. maxortizc@outlook.com.
Publikováno v:
Nature biomedical engineering [Nat Biomed Eng] 2024 Aug; Vol. 8 (8), pp. 938-940.
Autor:
Dong L; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Xue B; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Wei G; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China.; Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan, 030024, P. R. China., Yuan S; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Chen M; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Liu Y; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Su Y; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Niu Y; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China., Xu B; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China.; Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan, 030024, P. R. China., Wang P; Xi 'an Key Laboratory of Compound Semiconductor Materials and Devices, School of Physics & Information Science, Shaanxi University of Science and Technology, Xi'an, 710021, P. R. China.
Publikováno v:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2024 Aug; Vol. 11 (29), pp. e2403665. Date of Electronic Publication: 2024 Jun 03.
Autor:
Gao H; School of Electrical Engineering, Yanshan University, Qinhuangdao, Hebei 066004, P. R. China., Zhao F; School of Electrical Engineering, Yanshan University, Qinhuangdao, Hebei 066004, P. R. China., Liu J; Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin130022, P. R. China., Meng Z; School of Electrical Engineering, Yanshan University, Qinhuangdao, Hebei 066004, P. R. China., Han Z; Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin130022, P. R. China., Liu Y; Key Laboratory of Bionic Engineering (Ministry of Education), Jilin University, Changchun, Jilin130022, P. R. China.; Institute of Structured and Architected Materials, Liaoning Academy of Materials, Shenyang, Liaoning 110167, China.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 Jul 31; Vol. 16 (30), pp. 38811-38831. Date of Electronic Publication: 2024 Jul 20.