Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Bing Yeh Lin"'
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39ab3371e264021da85ef16f74f0a060
https://doi.org/10.1109/itherm54085.2022.9899653
https://doi.org/10.1109/itherm54085.2022.9899653
Publikováno v:
Microsystem Technologies. 24:1003-1016
In manufacturing processing, using copper wire for connecting each micro-device and constructing logical circuit to reduce RC time delay is a major technique. However, during fabrication, the thermo-mechanical mismatch between materials generate high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c221380232747ddd450b9bd9caee599
https://doi.org/10.1007/s00542-017-3448-z
https://doi.org/10.1007/s00542-017-3448-z