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Autor:
Tom Johnson, Thomas Krause, Anita Pratti, Snehamay Sinha, Bill Taboada, Tapobrata Bandyopadhyay
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
System co-design techniques are essential in ensuring good package and PCB designs that satisfies the signal and power integrity requirements of a system. This paper focuses on improving system-level signal integrity of high-speed serial links in hig