Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Bill Kalsbeck"'
Autor:
Eric Kwon, Bill Kalsbeck, Paul Chung, Wonil Cho, Suein Son, Gregg Inderhees, Il-Yong Jang, Chan-Uk Jeon, Jiuk Hur, JeongHun Seo, Min Choo, Alexander Tan, In-Yong Kang
Publikováno v:
Photomask Technology 2018.
As the semiconductor industry advances to ever-smaller nodes with finer feature sizes and more complex mask designs, reticle quality and reticle defects continue to be a top mask yield risk. The primary reticle defect quality requirement is defined a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fca639f9b742a35121801bb0aeeaf95
https://doi.org/10.1117/12.2511160
https://doi.org/10.1117/12.2511160
Publikováno v:
Photomask Technology.
The current industry plan is for EUV Lithography (EUVL) to enter High Volume Manufacturing (HVM) in the 2019/20 timeframe at about the 16nm half-pitch node (16hp). Reticle quality and reticle defects continue to be a top industry risk. The primary re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a660b61fbe919838c386b7e6b175fd2b
https://doi.org/10.1117/12.2281057
https://doi.org/10.1117/12.2281057