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pro vyhledávání: '"Bijan K. Saha"'
Publikováno v:
International Journal of Thermofluids, Vol 24, Iss , Pp 100923- (2024)
This study focuses on enhancing heat and mass transfer in an electronic cooling system such as a rectangular cavity that contains equidistant heated chips along the bottom wall. The cavity of the present study is filled with ethylene glycol (30:70) b
Externí odkaz:
https://doaj.org/article/1e8ac9aad27c496e907ae90eca8fb165